2929 Bondply Data Sheet
use in high performance, high reliability multi-layer constructions. A low dielectric constant
(2.9) and loss tangent (<0.003) at microwave frequencies makes it ideal for bonding multi
layer boards (MLB’s) made using PTFE composite materials such as RT/duroid® 6000, RO4000®
and RO3000® series laminates. The proprietary cross-linking resin system makes this thin
film adhesive system compatible with sequential bond processing while controlled flow
characteristics offer blind via fill capability and potentially predictable cutback ratios for
designs requiring blind cavities.
2929 bondply is compatible with traditional flat press and autoclave bonding. The film is
currently available in 0.0015”, 0.002” and 0.003” sheet thicknesses (0.038mm, 0.051mm, and
0.076mm). Individual sheets can be stacked to yield thicker adhesive layers. The unreinforced
thin film can be tack bonded to inner-layers to ease simultaneous machining of cut-outs
through core and adhesive layers. An easy-to-release carrier film protects the adhesive layer
from contamination during the machining and MLB booking processes.
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RT/duroid® 6000 、 RO4000 、 RO3000 、 2929 、 RO4000® 、 RO3000® 、 RT/duroid |
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[ Radar and Sensors ][ Point-to-point Microwave ][ Base Station Antennas ][ Power Amplifiers ][ Phased Array Radar ][ RF Components ][ Patch Antennas ][ Power Backplanes ] |
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Datasheet |
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Lead-Free |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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041519 |
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92-159 |
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262 KB |
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