CHO-BOND® 360 Conductive Epoxy Adhesive Caulk TECHNICAL BULLETIN
CHO-BOND® 360 compound is a relatively low cost,electrically conductive epoxy adhesive that combines the good adhesive characteristics as epoxy,and the superior electrical conductivity of silver.It is recommended as a thermo-setting EMI/RFI shielding compound and is effective even for designs requiring the use of a fillet as opposed to a flanged bead(with hardener 208).CHO-BOND 360 compound is excellent for poorly toleranced,non-flat surfaces which have been coated with a thin dielectric layer,such as Class 1 irridite or alodine.(Chomerics recommends MIL-C-5541 B,Class 3 when low electrical resistance and corrosion resistance are required).Its coarse granular silver-plated copper filler will abrade thin oxides from aluminum,copper and galvanized steel,especially when applied between flanges under modest contact pressure.
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CHO-BOND® 360 、 CHO-BOND 360-20 、 CHO-BOND 360-208 、 50-01-0360-0020 、 50-01-0360-0208 、 50-00-0360-0208 |
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Application note & Design Guide |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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Rev. 2-699 |
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1M699SG-369 |
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1.2 MB |
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