fastRise™ 7 Prepreg Preliminary Data Sheet
●fastRise™ 7 is a thermally stable, high DK(7.45 at 10 GHz), low loss prepreg designed to enable the manufacture of high dielectric constant stripline structures at low temperatures. fastRise™ 7 prepreg enables stripline manufacture at 420 ºF/215 ºC, well below the fabrication temperatures of Low Temperature Co-fired Ceramics (LTCC).
●Organic high dielectric constant copper clad laminates such as RF-60A have previously had no available prepregs with compatible high dielectric constant. Therefore RF stripline designers have been forced to use either LTCC or the fusion bonding of PTFE-based organic substrates.
●RF engineers design high dielectric constant stripline structures to: (1) densify/miniaturize circuits (2) eliminate cross talk between multiple channels (3) create more confined fields (4) create more symmetrical EM fields with better control over even/odd mode impedances (5) reduce radiation (6) allow for broadband multi-octave couplers and filters (7) design phase matching networks. Miniaturization is especially important for weight reduction in avionic applications.
●For organic structures, RF designers often resort to fusion bonding to create symmetrical dielectrics above and below the signal layer. Fusion bonding is the melting of PTFE at very high temperatures. Fusion bonding is expensive and prone to unpredictable dimensional movement and poor layer to layer registration and there are few capable fabricators*. fastRise™ 7 is a low cost solution that enables epoxy fabricators to build moisture resistant RF stripline structures.
●When combined with Ticer or Ohmega resistor foil, fastRise™ 7 leads to a lower likelihood of resistor cracking, a typical defect in fusion bonded structures.
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[ Military ][ Avionics ][ Radar Manifolds ][ Antennas ][ Fire Control ][ Filters ][ Couplers ][ Power Amplifiers ][ Phase Matching Networks ] |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2017/11/14 |
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rev. 7/15 |
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1.3 MB |
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