Thermal Model of EPC2203 Efficient Power Conversion Corporation
●The thermal model applies to EPC2203.
●A power dissipation of 1 W in the device active area is assumed.
●Finite element analysis (FEA) thermal simulations
■R-ΘJB and R-ΘJC are obtained by stationary simulations.
■Z-ΘJB and Z-ΘJC are obtained by transient simulations.
●R-C thermal model is generated.
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Technical Documentation |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2019/05/05 |
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1.7 MB |
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