Designing PCB Footprint for EPC eGaN® FETs and ICs

PublishTime：2020-10-27

EPC’s wafer level chip-scale packaging such as the Land Grid Array (LGA) and Ball Grid Array (BGA) packages shown in figure 1, has enabled a new level of performance in power conversion. Many of these parts use a fine pitch down to 400 μm which means a proper PCB footprint design is essential for consistent and reliable assembly of the GaN device. Here are the guidelines of designing a correct footprint for any EPC part working from the datasheet.
The purpose of this How2AppNote is to provide the information needed to create a PCB layout footprint for the eGaN FET using the solder mask opening and stencil recommendation provided in the datasheet. This will be done using as examples the EPC2016C and EPC2045 for an LGA and BGA format respectively. The layers involved are the copper immediately beneath the device, solder mask opening, proper silk-screen demarcation, and solder paste.
EPC recommends the use of a Solder Mask Defined (SMD) pad over a Non-Solder Mask Defined (NSMD) pad.
• A SMD footprint yields lower inductance and improves alignment during reflow.
• A NSMD footprint has a higher probability of die misalignment during reflow, which can reduce the effective copper contact area thereby degrading the solder joint and current carrying capability of the device.
Conclusion：This How2AppNote shows the design steps and the additional important considerations for a successful design of an EPC PCB footprint. It will result in a high yield and reliable assembly process when working with voltages 5 V and upwards.

Brand of Product：	EPC
Part#：	EPC2016C 、 EPC2045 、 EPC8XXX 、 EPC2XXX 、 EPC2040 、 EPC2035 、 EPC2203 、 EPC2036 、 EPC2037 、 EPC2038 、 EPC2051 、 EPC2039 、 EPC2108 、 EPC2107 、 EPC2106 、 EPC2110 、 EPC2012C 、 EPC2014C 、 EPC2007C 、 EPC2050 、 EPC8004 、 EPC8002 、 EPC8009 、 EPC8010 、 EPC2202 、 EPC2049 、 EPC2019 、 EPC2046 、 EPC2112 、 EPC2115 、 EPC2111 、 EPC2010C 、 EPC2015C 、 EPC2001C 、 EPC2047 、 EPC2030 、 EPC2031 、 EPC2029 、 EPC2032 、 EPC2033 、 EPC2034 、 EPC2024 、 EPC2020 、 EPC2021 、 EPC2206 、 EPC2022 、 EPC2100 、 EPC2101 、 EPC2102 、 EPC2103 、 EPC2105 、 EPC2104 More Part#
Product Category：	eGaN® FETs 、 ICs More
Application：	More
Data Type：	Application note & Design Guide More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：	LGA;BGA
Language：	English Chinese Chinese and English Japanese
Date of Creation：	2019/05/05
Version Number：
Data Encoding：	How2AppNote 008
Data Size：	1.4 MB

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