Lead Free Solder Reflow for Semiconductor Power Devices
The solders used in the Electronic Industry are rapidly converting from Tin/Lead (Sn/Pb) solders to Lead-Free (Pb-Free) solders to meet new environmental and Green requirements. Many of these requirements are controlled by laws and regulations, which vary by country and application. There has been a parallel shift for years from through-hole to surface mount assembly, which can often compound the Pb Free soldering issues. This paper will address the optimization of Pb Free soldering conditions, with a focus on differences between Sn/Pb and Pb Free soldering. This allows assemblers to build on their extensive experience with Sn/Pb solders.
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Application note & Design Guide |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2006 |
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IXAN0059 |
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130 KB |
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