Application Note CCS801 Assembly Guidelines
The CCS801 die construction consists of a membrane supported by a silicon frame. The membrane is very fragile so is protected from line of sight by the package lid. The sensing material is positioned in the centre of the membrane for optimum performance.
The CCS801isassembled into a 2mm x 3mm, 4 lead cavity Dual Flat No lead (DFN) package. The package consists of a pre-moulded lead-frame and a moulded lid which contains apertures to allow the unobstructed flow of ambient air through the package to ensure the Metal Oxide (MOX) sensing element is exposed to the analyte gas.
The package technology employed uses standard methods and materials to make it cost effective and scalable in high volume manufacture. Furthermore, the package outline and lead pitch make it ideal for high volume solder mount assembly onto low end PCB technology.
This application note offers guidance to the end user on correct handling and assembly of the CCS801 to prevent unnecessary damage to the product. Failure to follow these guidelines may impact performance and/or reliability of the product and, therefore, invalidate any warranties or guarantees.
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Application note & Design Guide |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2017-Aug-21 |
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v2-00 |
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461 KB |
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