OPEN-PIN-FIELD ARRAYS SEARAY™ HIGH-SPEED/HIGH-DENSITY SYSTEMS
●.050" (1.27 mm) pitch grid for maximum routing flexibility
●Up to 560 single-ended I/Os or 140 differential pairs
●Rugged Edge Rate® contact system less prone to damage when "zippered" during unmating
●7 to 40 mm stack heights
●Parallel, perpendicular, and coplanar applications
●Solder on each tail for ease of processing
●High-speed cable assemblies for 50 Ω or 100 Ω solutions
●Press-fit tails available
●VITA 57.1, VITA 57.4, VITA 74
●IPC-A-610F and IPC J-STD-001F Class 3 solder joint
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SEAM 、 SEAF 、 SEAM-RA 、 SEAF-RA 、 SEAMP 、 SEAFP 、 SEAFP-RA 、 SEAMI 、 SEAR 、 SEAC 、 UBPT 、 UBPS 、 JSO |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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APRIL 2018 |
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545 KB |
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