Electrostatic Discharge Protection
Electrostatic Discharge (ESD) is the process of accumulation of large amounts of charge on a body and rapid, uncontrollable discharge through another body with the possibility of causing damage. It is a subset of EOS, Electrical Overstress, which is a major concern in the electronics industry. ESD is potentially hazardous to semiconductor devices. Caution must be used when handling and testing semiconductor devices in order to avoid possible ESD damage to the semiconductor.
ESD events are typically characterized by low power dissipation (limited energy) and last for short periods, in the range of nanoseconds to milliseconds. ESD may result in catastrophic failures, but frequently result in performance degradation or latent failures. Also, the cumulative effect of repeated exposure can lead to complete failure. Typical indications of ESD damage are gate oxide breakdown, junction spiking, or input leakage failures. ESD events typically occur with device handling by automated handlers or assembly. The fundamental mechanism of ESD is called “tribocharging,” which occurs when different materials come in contact with one another and then separate, such as the sole of a person’s shoe as they walk across a carpet, or when an IC rubs against a rail on an automatic handler. The magnitude of the charge generated is dependent upon many factors, such as type of materials, speed at which they rub together, and the relative humidity of the environment.
Rogers recognizes the potential hazard of ESD to its IC inverter products, and practices standard procedures for ESD protection. All areas where semiconductor devices are handled must implement ESD prevention methods. Elements of standard ESD prevention procedures are included herein and highly recommended.
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User's Guide |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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12/06 |
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Revised 12/06 |
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Publication # LIT-T9010 A03 |
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59 KB |
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