2929 Bondply Multi-Layer Board Processing Guidelines
2929 bondply is an unreinforced, hydrocarbon based thin film adhesive system intended for use in high performance, high reliability multi-layer constructions. A low dielectric constant (2.9) and loss tangent (<0.003) at microwave frequencies makes it ideal for bonding multi-layer boards (MLB’s) made using PTFE composite materials such as RT/duroid® 6000 and RO3000® series laminates, filled hydro-carbon resin composites such as RO4000® cores, and specialty thin core laminates such as ULTRALAM® 3000. The proprietary cross-linking resin system makes this thin film adhesive system compatible with sequential bond processing while controlled flow characteristics offer excellent blind via fill capability and potentially predictable cutback ratios for designs requiring blind and/or buried cavities. 2929 bondply is compatible with traditional flat press and autoclave bonding.
The film is currently available in 0.0015”, 0.002”, and 0.003” thick sheets. Individual sheets can be stacked to yield thicker adhesive layers. The unreinforced thin film can be tack bonded to inner-layers to ease simultaneous machining of cut-outs through core and adhesive layers and to facilitate formation of vias using conductive pastes. An easy to release carrier film protects the adhesive layer from contamination during machining, screening of conductive pastes, and MLB booking.
These processing guidelines offer current “best practices” procedures and parameters for bonding MLB’s using 2929 bondply.
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User's Guide |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2017/08/01 |
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Publication #92-517 |
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94 KB |
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