fastRise™ EZ pure Resin

2022-09-07

●fastRise™ EZpure is a low temperature curing adhesive for flexible and rigid PWBs. EZpure is a non-reinforced adhesive containing only a low loss thermosetting resin and ceramic additives. EZpure has been optimized to adhere to difficult-to-bond-to substrates like PTFE, polyimide (DuPont™ Pyralux® AP/TK flexible circuit materials) and LCP.
●The primary drawback of polyimides, LCPs and PTFE is the high temperatures normally associated with multilayer fabrication. EZpure can be laminated at 200°C, thus preventing any unwanted dimensional movement of the copper clad laminate core. Because EZpure has no reinforcement and uses only submicron or micron sized additives , it should be laminated at low pressure (~ 100 psi) because there is nothing restraining high flow.
●In testing EZpure bondply with LCP cores, PWBs have passed 260°C and 300°C solder reflow without defects. FR-EZpure has exhibited 5-7 lbs. of adhesion to LCP cores and that adhesion is stable after 260°C and 300°C thermal cycling.
●EZpure’s low loss enables the design of flexible high speed cables and rigid RF/digital multilayers without the uncertainties and costs associated with the high temperature lamination of PTFE or LCP materials. EZpure can be used to replace cable harnesses with denser flex circuits. The lack of a reinforcement makes EZpure a great candidate for laser vias. The low moisture absorption of 0.3% is very attractive vs. conventional polyimides.
●EZpure can be sequentially laminated and has better bonding capabilities with copper than other RF prepregs. The low DK of EZpure is advantageous in flex applications to reduce thickness while maintaining the same impedance. The low modulus of EZ pure allows for more ductility in a thicker multilayer. The low dissipation values of EZpure is an option for any multilayer stackup where pure packages of other materials have fabrication challenges.

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EZ pure Resinlow temperature curing adhesivenon-reinforced adhesive

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High Speed Flex Cables ]Thin Multilayers ]ATE testing ]mmWave Antenna ]mmWave Automotive ]Subassemblies ]

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2018/02/05

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