Qualcomm® QCC300x Family Bluetooth Audio SoCs
●QCC300x flexible System-on-Chips (SoCs) support increased OEM customization and are engineered to offer a rich set of audio features which have not typically been associated with mid to low tier Bluetooth wireless audio devices.
●The QCC300x family includes eight SoC devices – five (QCC3001 – QCC3005) which support Bluetooth headset applications, and three (QCC3006 – QCC3008) for Bluetooth speaker applications. Coupled with the audio development kit (ADK) and tools, these devices help to provide a flexible, cost effective platform for designing high quality Bluetooth audio products.
●A single-chip dual-mode Bluetooth 5 system, QCC300x SoCs feature 8th generation Qualcomm® cVc™ Noise Cancellation Technology with one and two microphone inputs; an enhanced GAIA designed for better communication with mobile devices; and has external QSPI flash memory for configuration and voice prompts.
●More consumers are making the move to wireless due to disruptive industry events like the removal of the headphone jack. By offering a wider range of what were once considered premium features at a competitive price point, the QCC300x platform supports expansion of the overall wireless audio market and potential of increased unit sales.
●Features
■Dual-mode Bluetooth 5 qualified radio
■Variants designed to address both headsets/headphones and speaker applications
■Low-power Qualcomm® Kalimba™ DSP with on-chip ROM and RAM, stereo codec, battery charger, switch mode and linear regulators and LED drivers in a single chip solution
■Customizable application code
■Access to technologies such as Link Layer and Dual Mode topologies (LLT/DMT), Qualcomm® aptX™, cVc noise cancellation technology and Qualcomm TrueWireless™ Stereo (depending on variant)
■A rich set of features, use cases and programmability at more cost-effective price points
■Pin compatible with CSRA63xxx and CSRA64xxx family of products
■Supports OTA updates
■Integrated Qualcomm TrueWireless Stereo technology
■Qualcomm® meloD™ Expansion audio processing: 3D stereo widening
■aptX and aptX Low Latency capabilities to help deliver high quality, synchronized stereo audio for wireless audio/video applications. (QCC3002, QCC3005 and QCC3008 only)
■SBC and AAC codecs
■Promotes reduced development time with support of application image and source code, IDE and configuration
■Updated Generic Application Interface Architecture (GAIA) protocol v3
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QCC300x 、 QCC3001 、 QCC3002 、 QCC3003 、 QCC3004 、 QCC3005 、 QCC3006 、 QCC3007 、 QCC3008 、 DK-QCC3001-WLCSP-CE752-1A 、 DB-QCC3001-WLCSP-CE752-1A 、 DK-QCC3001-BGA-CE889-1A 、 DB-QCC3001-BGA-CE889-1A 、 DK-QCC3002-WLCSP-CE751-1A 、 DB-QCC3002-WLCSP-CE751-1A 、 DK-QCC3002-BGA-CE890-1A 、 DB-QCC3002-BGA-CE890-1A 、 DK-QCC3003-6x6QFN-CE690-1A 、 DB-QCC3003-6x6QFN-CE690-1A 、 DK-QCC3004-BGA-CE742-1A 、 DB-QCC3004-BGA-CE742-1A 、 DK-QCC3005-BGA-CE729-1A 、 DB-QCC3005-BGA-CE729-1A 、 DK-QCC3006-8x8QFN-CE680-1A 、 DB-QCC3006-8x8QFN-CE680-1A 、 DK-QCC3007-8x8QFN-CE679-1A 、 DB-QCC3007-8x8QFN-CE679-1A 、 DK-QCC3008-8x8QFN-CE678-1A 、 DB-QCC3008-8x8QFN-CE678-1A |
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Bluetooth Audio SoCs 、 flash audio SoCs 、 System-on-Chips 、 SoCs |
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[ headset ][ speaker applications ][ Bluetooth Earbuds ][ Bluetooth Car Speakers ][ Portable Speakers ][ Bluetooth Speakers ] |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2018/04/14 |
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Rev. B |
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588 KB |
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