Lanshan Automotive Electronics Signs Contract With Sgs Electronics To Promote The Development Of “Chip“ In Chongqing

PublishTime： 2025-10-27 Article Source：Lanshan Electronics official website Author：Chongqing Lanshan Automotive Electronics Co., Ltd.

Recently, the strategic cooperation signing ceremony between Chongqing Lanshan Automotive Electronics Co., Ltd. (hereinafter referred to as "Lanshan Automotive Electronics") and SGS ISO 26262 Automotive Functional Safety Certification Project was successfully held in Chengdu. Li Tao, CEO of Lanshan Automotive Electronics, Fang Da, Deputy Director of R&D at Lanshan Automotive Electronics, Yang Li, Deputy Director of R&D at Lanshan Automotive Electronics, Lv Binsi, Director of SGS China Automotive Services, and Bao Yan, Senior Manager of SGS Automotive Services South, attended the signing ceremony.

Signing of functional safety product certification project

Signing of functional safety process construction project

The signing of this strategic agreement is the result of friendly communication and honest cooperation between both parties. As the first semiconductor design company established under the leadership of the district government in the central and western regions, aimed at supporting local and surrounding OEM manufacturers, Lanshan Automotive Electronics dares to challenge the international authoritative ISO 26262 automotive functional safety certification, reflecting its chip research and development strength and confidence in providing chip products and services that meet ISO 26262 requirements for automotive manufacturers。

Group photo of representatives from both sides

Li Tao, CEO of Lanshan Automotive Electronics, stated that with the continuous development of intelligent and networked automobiles, the annual growth rate of automotive grade MCUs is expected to exceed 10%, and the market space is expected to exceed 10 billion US dollars by 2024. Among them, CR6 cars account for over 95%, while domestic manufacturers only account for about 2% -3%. The vast market space in China is in stark contrast to the relatively low market share of domestically produced MCUs. Stimulated by a series of policies from the Ministry of Industry and Information Technology, there is a clear trend towards domestic substitution. Lanshan Automotive Electronics has leading core technologies, rich experience in developing automotive grade MCUs, stable ecological alliances, and complete upstream and downstream industry chain advantages. Its goal is to complete the production of the entire series of high, medium, and low-end MCU chips by 2024, and become one of the top tier automotive grade MCU chips in China.

Lv Binsi, Director of SGS China Automotive Services Department, said: SGS wishes all milestones of the project to be delivered as scheduled and the smooth completion of this project with close cooperation between both parties. SGS, with its global experience and professional team, has provided automotive functional safety certification for many well-known car manufacturers and automotive grade chip products. This time, it will also help Lanshan Automotive Electronics establish a product development and management process system that meets ISO 26262 functional safety requirements, and create more competitive products in the market. In the field of automotive intelligent chips and software, SGS can provide enterprises with IATF 16949 system certification, ISO 26262 functional safety certification, AEC-Q series testing and certification, ISO 21434 network security and other services to help domestic and foreign related enterprises improve product quality.

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