INSTRUCTION: Z‐Wave 700 Integration Guide

PublishTime： 2023-02-24 Manufacturer： Silicon Labs Type： User's Guide Language： English

■The purpose of this document is to provide an implementation guide for integrating Z‐Wave 700 devices into product designs. It is intended for product design engineers who aim for a fast integration of Z‐Wave 700 devices.
■OVERVIEW
●The Z‐Wave 700 device portfolio is shown in Table 1.1. The EFR32ZG14 SoC exposes the Z‐Wave serial API via UART and is dedicated to gateway applications. The ZGM130S SiP module combines a general‐purpose SoC, crystal, supply decoupling components, and RF matching components into a single small‐footprint module requiring only two decoupling capacitors. The ZGM130S is mainly targeted at end‐device applications, and, with its built‐in ARM M4 core and ultra‐low‐power consumption, it is perfect for making single chip sensors and other end devices that require advanced processing and low‐power consumption. Alternatively, the ZGM130S SiP module can be used in gateway applications as well.
●Please refer to [1] for an overview of supported Z‐Wave regions and frequency bands supported by the Z‐Wave protocol.

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