TDK Starts Full-scale Production of SmartAutomotive™ IAM-20685, ASIL-B monolithic 6-axis MEMS IMU to Enhance Automotive ADAS Applications
January 03, 2023——TDK Corporation announces today the full-scale production of InvenSense IAM-20685, the smallest ASIL-B monolithic 6-axis MEMS IMU developed in compliance with ISO 26262 for ADAS and autonomous car systems.
The IAM-20685 supports a wide range of ADAS applications, including but not limited to automated parking, ADAS domain controller, and vision systems.
"Thanks to its 6-axis integration and its ASIL-B compliancy at the component level, the IAM-20685 simplifies automotive ADAS systems development, helping overcome weaknesses of other technologies," said Alberto Marinoni, Sr Director – Product Marketing Automotive at InvenSense, a TDK Group company. "The high level of performance and the smallest size in the market means the IAM-20685 is the best IMU to integrate in positioning, vision, and radar modules in order to enhance their performance when the satellites are not available, road vibrations are applied, and the tilt is unknown, respectively.”
Main Applications
IAM-20685 addresses a wide range of automotive applications, including but not limited to:
●ADAS
●Autonomous driving systems
●Automated parking
●Vehicle redundant IMU
●Vision systems (camera, radar, LIDAR)
●Navigation system aids in dead reckoning
●Telematics
●Accurate positioning for vehicle-to-vehicle and infrastructure
Main Features and Benefits
●ASIL-B rated per ISO 26262
●Robust architecture for functional safety:
6 independent MEMS-proof masses
6 independent analog front-end
●Operating Temperature range from -40℃ to 105℃
●Reliability testing performed according to Automotive Electronics Council AEC – Q100 grade 2
●Gyroscope full-scale: user selectable from ±41dps to ±1966dps
●Accelerometer full-scale: user selectable from ±2g to ±65g
●Two embedded temperature sensors
●16-bit on-chip ADCs for accelerometer, gyroscope, and temperature sensor
●SPI serial interface with CRC
●24-pin QFN package 4.5×4.5×1.1mm³ with a wettable flanks option
Table.1
- +1 Like
- Add to Favorites
Recommend
- TDK Presents Second-Generation 6-axis IMUs for Advanced Driver Assistance and Safety Applications
- TDK Announces the InvenSense ICP-10125 Waterproof SmartPressure™ Sensor Platform, Achieving the Industry’s Lowest Pressure Noise of 0.4 Pa RMS
- TDK Launches InvenSense Sensor Partner Program to Empower IoT innovation with Sensor Technology
- InvenSense® Provides High-Accuracy Turn-By-Turn Navigation User Experience To HiSilicon Mobile Platforms and Huawei Smartphones
- TDK’s New SmartMotion® Platform Accelerates Development of IOT Solutions Based on Invensense Motion Sensors
- InvenSense® Announces UltraPrint™ Mass-Manufacturable Ultrasound Fingerprint Touch Sensor Solution
- InvenSense® Ushers in the Era of Sensor System-On-Chip With the World’s First Integrated Motion Sensor and Multi-Core Processing
- InvenSense® Announces Contextual Awareness SDK for Embedded Developers and Mobile Devices
This document is provided by Sekorm Platform for VIP exclusive service. The copyright is owned by Sekorm. Without authorization, any medias, websites or individual are not allowed to reprint. When authorizing the reprint, the link of www.sekorm.com must be indicated.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
