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What are the benefits of using liquid instead of air cooling systems?
2024-10-30 - Technical Q&A Liquid heat exchangers can reduce the thermal resistance of conventional heat sink fan dissipation mechanisms by a factor of 10 or more, which makes it much more efficient. This is due to the poor thermal properties of air versus coolants such as water. Liquid cooling systems have a more rapid cool down time, which means less time to reach the desired temperature. While conventional air cooling systems push air all around the system, and can potentially add heat from surrounding hot electronics, liquid cooling systems are equipped with a heat exchanger that routes heat away through a liquid circuit. Air-cooling systems in the higher capacity range often require larger fans, which can increase noise as well as the size of the system.
What are the factors that affect the quality of the tact switch?
2024-11-28 - Technical Discussion As we all know,the seemingly inconspicuous shape of the tact switch is implied by great practical value.When we use the tact switch,we not only experience its excellent conduction performance,convenient control,but also the comfortable button feel.For the tactile switch itself,it has a precise structure,materials,processes,etc.So among the many factors,what affects the overall quality of the tact switch?
What is the Thermal Wizard?
2024-10-30 - Technical Q&A The Thermal Wizard is a product search and selection tool that helps engineers find the optimal thermal management solution for thermoelectric coolers, thermoelectric cooler assemblies and liquid cooling systems.
How can I tell that thermoelectric cooling is the most suitable for my application?
2024-10-30 - Technical Q&A Thermoelectric cooling systems are most beneficial in applications with Tight space constraints, Low heat load capacities, typically less than < 400W, Control temperatures below ambient, Precise temperature control, Heating and cooling.
What is the node capacity that the RG-02 gateway can carry?
2024-06-17 - Technical Q&A The number of nodes that the gateway can access is related to the data reporting interval, data packet length and other factors. Relevant actual test parameters: 20min reporting interval under the condition of 200+ nodes and stable communication. The theoretical capacity is 62500 under the condition of 1h interval.
What is the smallest thermoelectric cooler that LTS provides?
2024-10-30 - Technical Q&A The OptoTEC™ OTX/HTX Series is our smallest thermoelectric module starting at 3.3 x 4.9 x 2.6-mm (LxWxH) with a cooling capacity of 0.4 Watts.
What kind of applications use thermoelectric cooling technology?
2024-10-30 - Technical Q&A Refrigeration – Applications requiring cooling below ambient temperature -Chamber cooling for medical diagnostics -Sample storage compartment cooling for analytical instrumentation Spot Cooling – Applications requiring cooling of a specific sensitive electronic below worst-case ambient temperature -CMOS sensors -LiDAR -DLP -Optical components Precise Temperature Control – maintaining stable temperature while surrounding environment temperature changes -Industrial laser -Medical laser -Optical transceivers Heat and Cool – Applications requiring heating and cooling -Incubators cooling then heating to body temperature -Kiosks cooling or heating of sensitive electronics between two temperature set points -Battery backup cooling or heating between two temperature set points. Thermal Cycling -DNA amplification for PCR -Burning in test sockets
Is it possible to stack Thermoelectric coolers to achieve higher temperature differential, ΔT?
2024-10-30 - Technical Q&A Yes. The Multistage MS Series is able to reach colder temperatures than single stage thermoelectric coolers. Laird Thermal Systems offers two, three, four and five stage thermoelectric coolers that achieve temperature differentials of up to 131°C in a vacuum. The drawback is efficiency will go down with each stage.
About potential difference of the aluminum case and each electrode terminal
2024-08-30 - Technical Q&A The aluminum electrolytic capacitor case is connected with a cathode terminal and an unstable resistance component, which can result in equivalent potential that is unstable. A potential difference may occur due to the presence of an oxide film with high withstand voltage properties between the case and the anode terminal.
When is a custom solution necessary to solve a thermal problem?
2024-10-30 - Technical Q&A A standard solution is typically designed for general purpose applications. Since there are an unlimited number of application possibilities, standards cannot fulfill all application requirements. Achieving a fine-tuned specification generally results in some level of customization, whether it is capacity vs form factor or efficiency. Trial and test validation typically leads to determining if a standard is suitable for application or not.
I compile C language code using CCU8. In the case, are there any differences in C language grammar from ANSI C?
2024-08-30 - Technical Q&A The following functions are supported in implementation on C language of CCU8 compiler; therefore, there are some differences with the standard ANSI X3.159-1989 and ISO/IEC 9899 proposed by ANSI (American National Standards Institute). 1. Supports the specification of INTERRUPT function. 2. Unable to modify structure or shared members with "const". 3. Able to use the bit field of char with the structure or shared members. 4. Unable to modify argument with "const". 5. Handles a declaration without a type specifier, type modifier or memory area class specifier as the declaration of "int" type. 6. Able compare a pointer with a constant integer formula, and a pointer to void using a relational operator. 7. Supports __near and __far data modifiers. 8. Supports __noreg relational modifier. 9. Supports the __asm keyword. 10. Supports the single line comment (//). 11. Supports the following built-in functions. __EI __DI __segbase_n __segbase_f __segsize For C language syntax and specification on CCU8 compiler, refer to "CCU8 Language Reference" manual. Related Products: ML610(Q)40x, ML610(Q)42x, ML610(Q)47x, ML610(Q)48x, ML610Q10x, ML610Q11x, ML610Q17x, ML610Q30x, ML610Q35x, ML610Q36x, ML610Q38x, ML610Q41x, ML610Q43x, ML610Q46x, ML620Q13x, ML620Q15x, ML620Q416/ML620Q418, ML620Q503H/ML620Q504H/ML620Q506H, ML62Q12xx, ML62Q13xx, ML62Q14xx, ML62Q15xx/ML62Q18xx, ML62Q16xx, ML62Q17xx
What effect can be expected when the boosting clock frequency of LCD bias is set to high speed?
2024-08-30 - Technical Q&A When the boosting clock frequency of LCD bias is set to high speed, the display quality improves from stable LCD power supply due to improved current supply capacity, though the consumed current increases a little. Necessary current supply capacity depends on the load capacity and frame frequency of LCD panel; therefore, evaluate stability of the LCD power supply by actually using the LCD panel, and select an adequate boosting clock frequency. Related Products: ML610(Q)40x, ML610(Q)42x, ML610(Q)47x, ML610Q17x, ML610Q38x, ML610Q41x, ML610Q43x, ML610Q46x, ML620Q416/ML620Q418, ML62Q16xx, ML62Q17xx
Which domestic crystal oscillator manufacturer can do high-precision temperature crystal vibration, temperature stability can be ±0.05ppm, the operating temperature is -40~85℃?
2025-01-27 - Technical Q&A XTALTQ's BT0503 and BT0507B are recommended, both crystal oscillators can achieve ±0.05ppm, -40~85℃operating temperature.
Why does the destination of a BRK instruction from the startup assembler become an endless loop?
2024-08-30 - Technical Q&A The reason for this is fail-safe measures. We recommend that unused ROM areas are filled with 0FFFFh (BRK instructions). Even if a program running away out of control should branch to unused program areas, the program waits at the endless loop, which enables you to reset the WDT safely. Related Products: ML610(Q)40x, ML610(Q)42x, ML610(Q)47x, ML610(Q)48x, ML610Q10x, ML610Q11x, ML610Q17x, ML610Q30x, ML610Q35x, ML610Q36x, ML610Q38x, ML610Q41x, ML610Q43x, ML610Q46x, ML620Q13x, ML620Q15x, ML620Q416/ML620Q418, ML620Q503H/ML620Q504H/ML620Q506H, ML62Q12xx, ML62Q13xx, ML62Q14xx, ML62Q15xx/ML62Q18xx, ML62Q16xx, ML62Q17xx
How can I judge whether or not the product is usable for the transitional surge current. If the current pulse duration is shorter than the described condition, is the larger surge current acceptable?
2024-07-29 - Technical Q&A In past days, surge current capability of a discrete diode had been considered to follow the I2t-constant law, as is the case with current fusing phenomenon. However, for more accurate estimation, the I2√t-constant law is preferable. Therefore, guaranteed values for higher current products like as diode modules are calculated by I2･t , and lower current products like as discrete diodes should be calculated by I2√t. Even in this case, the resistance does not increase without limit, and the value at 100 μs is considered as the upper limit value for energization of 100 μs or less. In the case of a few micro seconds of electricity energizing time and a large duty, a limit could be caused due to the root mean squared value. ●Calculating formula for allowable current: I2√t =（IFSM／√2）2× √10ms IFSM: Surge forward current resistance value shown in Specifications or catalogues ｔ: Current pulse duration (100μs = 0.0001s at minimum) The allowable current "I" can be obtained by substituting each value into the above formula. However, it would be corrected due to waveforms and energizing frequency. Square waveform: I itself Triangular waveform: I×√3 Half sine wave: I×√2 1. One shot current pulse: Current forcing only once in the circuit during the lifetime The calculated value as above 2. A few current pulses in a day: Irregular and long-interval current pulses when the power turns on etc. Half of the calculated value as above 3. Energizing continuously: Continuous energization A quarter of calculated value as above
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