- +1 Like
- Add to Favorites
Recommend
LG69T (AM,AS) EVB User Guide
2022-10-20 - User's Guide
GNSS MODULE SERIES,GNSS模块系列,LG69T (AS),LG69T (AM)
【EOL】SILICON LABS End of Life Notification 8-bit MCU ToolStick Starter Kit and Daughter Cards (200707814)
7/7/2020 - PCN/EOL
DAUGHTER CARDS,子卡,8-BIT MCU TOOLSTICK STARTER KIT,8位MCU TOOLSTICK入门套件,TOOLSTICK850-B-DC,TOOLSTICKUNIDC,C8051F300DK,C8051F340DK,C8051F380DK,C8051F996DK,SIM3U1XX-B-DK,TOOLSTICK800DC,TOOLSTICKDA,TOOLSTICK912DC,TOOLSTICK700DC,TOOLSTICK381DC,TOOLSTICK360DC,C8051F330DK,TOOLSTICKUNISK,TOOLSTICKCLASSD,C8051F336DK,TOOLSTICK370-A-DC,C8051F500DK,TOOLSTICK850-B-SK,C8051F580DK,C8051F540DK,C8051F912DK,TOOLSTICK560DC,MCUNIVERSITYKIT,C8051F320DK,C8051F326DK,C8051F360DK,TOOLSTICK321DC,TOOLSTICK530ADC,TOOLSTICK342DC,TOOLSTICK300DC,TOOLSTICK990DC,TOOLSTICK327DC,C8051F530ADK,C8051F800DK,C8051F560DK,TOOLSTICK931DC,C8051F310DK,DEBUGADPTR1-USB,TOOLSTICK411DC,C8051F930DK,TOOLSTICK311DC,C8051F850-B-DK,TOOLSTICK336DC,TOOLSTICK502DC,TOOLSTICKSK,C8051F410DK,TOOLSTICK540DC,TOOLSTICK582DC,TOOLSTICK330DC
How reliable is Thermoelectric cooling?
2024-10-30 - Technical Q&A Thermoelectric coolers are highly reliable because they have a solid-state construction with no moving parts. They are also known for having a high mean time between failures (MTBFs). It is difficult to estimate the lifetime of a thermoelectric cooler, due to the variables in application conditions such as changes to heat load, on/off cycling, heat or cooling, drive circuit and system design with protection against condensation. All variables can influence the product’s lifetime. However, for demanding applications such as modern diagnostic, which require high rates of thermal cycling, the PowerCycling PCX Series thermoelectric coolers have been tested to withstand rigorous cycle testing based on latest PCR industry test protocol without degradation in performance.
What are the advantages of using Thermoelectric cooling instead of compressor-based systems?
2024-10-30 - Technical Q&A Thermoelectric coolers have no moving parts; their solid-state construction results in higher reliability, lower maintenance and lower overall operating costs. Solid-state construction also allows Thermoelectric coolers to be mounted in any orientation. A compact form factor makes them suitable for applications where size constraints exist. Thermoelectric coolers can cool well below ambient. By using a multistage thermoelectric cooler in a vacuum environment, the device can reach a temperature of -100°C. Thermoelectric coolers can achieve precise temperature control (up to ± 0.01°C under steady state) because they are able to heat and cool by simply reversing polarity, which changes direction of the heat transfer. This ability also makes them suitable for applications requiring both cooling and heating. Thermoelectric coolers are also environmentally friendly because they do not use hazardous CFC’s or produce electrical noise.
What kind of applications use thermoelectric cooling technology?
2024-10-30 - Technical Q&A Refrigeration – Applications requiring cooling below ambient temperature -Chamber cooling for medical diagnostics -Sample storage compartment cooling for analytical instrumentation Spot Cooling – Applications requiring cooling of a specific sensitive electronic below worst-case ambient temperature -CMOS sensors -LiDAR -DLP -Optical components Precise Temperature Control – maintaining stable temperature while surrounding environment temperature changes -Industrial laser -Medical laser -Optical transceivers Heat and Cool – Applications requiring heating and cooling -Incubators cooling then heating to body temperature -Kiosks cooling or heating of sensitive electronics between two temperature set points -Battery backup cooling or heating between two temperature set points. Thermal Cycling -DNA amplification for PCR -Burning in test sockets
EFM8 Universal Bee Family EFM8UB2 Data Sheet
2017/07/27 - Datasheet
A MULTI-PURPOSE LINE OF 8-BIT MICROCONTROLLER,一种8位微控制器的多用途线路,EFM8UB2,EFM8UB20F32G-B-QFN32,EFM8UB20F64G-B-QFN32,EFM8UB20F32G-B-QFP32,EFM8UB20F64G-B-QFP32,EFM8UB20F64G-B-QFP48,EFM8UB20F32G-B-QFP48,UNIVERSAL BEE,EFM8UB20F64G-A-QFP48R,EFM8
If end_address of the ROMWINDOW pseudo instruction is changed from DFFFh (for ML620Q156) in the assembly source, an error occurs.at assembly. Is it possible to change the ROM window area? Also, is it possible to locate the TABLE segment outside the ROM window area?
2024-08-30 - Technical Q&A It is not possible to change the ROM window area because it is fixed for each product. Also, it is not possible to locate the TABLE segment outside this area because it needs to be located in the readable program area (= ROM window area). Related Products: ML620Q15x
Sensitivity
2024-08-30 - Technical Q&A There are 2 options for the sensitivity: High (default and recommended) and Low. With higher sensitivity, the sensor is able to measure smaller changes in force (higher resolution), but the range of the sensor measurements is also smaller (the sensor will saturate at lower forces). For details (range and resolution) for the different sensor models, please refer to the datasheets on our Support Page.
Is it possible to stop the counting of the watchdog timer in the 1000 series?
2024-08-30 - Technical Q&A You can use code options to select whether to enable/disable operation of the watchdog timer, whether to enable/disable operation in the STOP mode/STOP-D mode, and the operation clock of the counting of the watchdog timer. However, because code options take effect at the time of a system reset, you cannot use the program to change them after the reset. Related Products: ML610(Q)40x, ML610(Q)42x, ML610(Q)47x, ML610(Q)48x, ML610Q10x, ML610Q11x, ML610Q17x, ML610Q30x, ML610Q35x, ML610Q36x, ML610Q38x, ML610Q41x, ML610Q43x, ML610Q46x, ML620Q13x, ML620Q15x, ML620Q416/ML620Q418, ML620Q503H/ML620Q504H/ML620Q506H, ML62Q12xx, ML62Q13xx, ML62Q14xx, ML62Q15xx/ML62Q18xx, ML62Q16xx, ML62Q17xx
When I changed the variable name or function name, the HEX file that was built and output was changed.I thought that the output HEX file would not be changed if only the name was changed, but why is the output HEX changed?
2024-08-30 - Technical Q&A HEX is changed when the variable name or function name is changed because of the specifications of the RLU8 linker. When allocating variables or functions to memory, RLU8 Linker assigns a management value based on the variable name or function name, and allocates to memory based on the management value. When the variable name or function name is changed, the management value given changes and the order / allocation address of the memory allocation process changes, resulting in a change in HEX. Also, if you change the file name, the HEX will change in the same way. Related Products: ML610(Q)40x, ML610(Q)42x, ML610(Q)47x, ML610(Q)48x, ML610Q10x, ML610Q11x, ML610Q17x, ML610Q30x, ML610Q35x, ML610Q36x, ML610Q38x, ML610Q41x, ML610Q43x, ML610Q46x, ML620Q13x, ML620Q15x, ML620Q416/ML620Q418, ML620Q503H/ML620Q504H/ML620Q506H, ML62Q12xx, ML62Q13xx, ML62Q14xx, ML62Q15xx/ML62Q18xx, ML62Q16xx, ML62Q17xx
What changes were mainly made to Bluetooth v5.0?
2024-08-30 - Technical Q&A The main changes are (1) double the communication speed, (4) communication distance extended fourfold, and (3) advertisement packet capacity increased eightfold. Bluetooth v5.0 is a standard released in December 2016. It has the following three features over Bluetooth v4.2: (1) communication speed is two times faster, (2) communication distance is four times longer, and (3) advertisement packet capacity is eight times larger. Double the communication speed has been achieved by adding 2 Mbps (originally 1 Mbps) as the symbol rate. The quadruple distance is achieved by adding error correction codes to improve error resilience. Instead, the data rate is decreased. LE Coded PHY (500 kbps, 125 kbps) corresponding to this error correction code has been added, and the data rate to enable the quadruple distance is 125 kbps. The data capacity has been expanded from 31 octets to 255 octets with the advertisement packet capacity increased eightfold. This allows broadcasting of more information than ever before.
Electronic Mall
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
