QUALIFICATION REPORT

RELIABILITY LABORATORY

PCN #: JAON-24XLPK873

Date

January 22, 2016

Qualification of Microchip 8 inch Fabrication site for Micrel products

manufactured with the BCC Process Technology.

PART NUMBER PACKAGE TYPE ASSEMBLY LOCATION WAFER SIZE PROCESS NAME

MIC5205YM5 SOT23-5L STARS THAILAND 8” BCC

DIE QUALIFICATION RESULTS

TEST DESCRIPTION METHOD/CONDITIONS

DATE

CODE

LOT ID.

168 HR

Rej/ss

1000 HR

Rej/ss

COMMENTS

HTOL

High Temperature

Operating Life Test

JESD22, Method 108

TA= + 125°C

VCC = +16V

1541

1542

1543

V216.185667.000MQA

V216.185667.100MQA

V216.185667.121MQA

0/77

0/77

0/77

0/77

0/77

0/77

ELECTROSTATIC DISCHARGE

TEST DESCRIPTION METHOD/CONDITIONS

DATE

CODE

LOT ID. STRESS

RESULT

Rej/ss

COMMENTS

ESD-HBM

Human Body Model

ATE Test @ Room +25C

R= 1500 Ohms

C= 100 pF

1X +/- Voltage

1541

V216.185667.000MQA

+/-500V

0/3

Note: ESD ratings are

device specific. All Products

qualified on the 8” Micrel

process technologies will

have the same or better

ESD and Latch-up

performance as the 6” San

Jose Products.

ESD-CDM

Charged Device Model

ATE Test @ Room +25C

JESD22-C101

1X +/- Voltage

1541

V216.185667.000MQA

+/-1500V 0/3

TEST DESCRIPTION METHOD/CONDITIONS

DATE

CODE

LOT ID. STRESS

RESULT

Rej/ss

COMMENTS

LATCH-UP

JESD-78

TA = +25°C

1541

V216.185667.000MQA

I/O LU

O/V LU

0/6

0/6