No.60P7109E-C 05.2018

3000PP

2018March

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Android

is a registered trademark of Google Inc.

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Arduino is a registered trademark of Arduino LCC and Arduino SRL

●

ARM

and Cortex

are registered trademarks of ARM Limited (or one of its subsidiaries) in the EU and other countries.

mbed

is a trademark of ARM Limited (or one of its subsidiaries) in the EU and other countries.

●

The Bluetooth

word mark and logo are registered trademarks owned by Bluetooth SIG, Inc, and are used under license.

All other trademarks and trade names are the property of their respective owners.

●

Raspberry Pi is a trademark of Raspberry Pi Foundation.

●

Sigfox

is a registered trademark of SIGFOX S.A.

●

XBee

is a trademark or registered trademark of Digi International in the US and other countries.

●

EnOcean

is a registered trademark of EnOcean GmBH.

●

Directional Tap/Double-Tap

are trademarks of Kionix.

●

U8 Core is LAPIS Semiconductor's original 8bit RISC-type CPU. U16 is LAPIS Semiconductor's original 16bit RISC-type CPU.

●

uEASE and nanoEASE are LAPIS Semiconductor's on-chip debug emulators.

Connect with IoT

Sensor Catalog

Vol.3.1

Sensor Catalog 02

Providing greater convenience, comfort, and safety

ROHM has developed a variety of sensor products based

on a wide range of technologies, from piezoelectric thin-film

deposition technology cultivated from high reliabilit y

semiconductor exper tise, silicon d eep etc hing, and

multilayer filter technologies to wafer bonding and advanced

packaging technologies.

With the addition of LAPIS Semiconductor, a pioneer in

sensing processing technology, in 2008, and global MEMS

accelerometer supplier Kionix in 2009, the ROHM Group

has established itself as a market leader in the sensor field,

offering an u

nprecedented lineup.

ROHM's industry-leading lineup includes motion sensing

devices capable of accurately detecting position and

movement, environmental sensors offering real-time

detection of ambient conditions, interface devices optimized

for amplifying, analyzing, and processing sensor signals,

and MCUs designed to control multiple sensors - along with

short-range wireless communication ICs and modules that

support sub-GHz, Bluetooth

, and wireless LAN. Combining

these gives designers the freedom and flexibility to create

sensor-based applications that can detect and transmit a

variety of information, opening up new possibilities.

ROHM offers total solutions optim

ized to customer needs by

combining proprietary technologies and market-proven

expertise covering the entire manufacturing process, from

silicon ingots used as core materials to device development,

including algorithms and driver software along with control

ASICs and wireless communication modules.

Leveraging the combined resources of the entire Group will

allow ROHM to engage in CSR activities while pursuing

greater safety, efficiency, convenience, and environmental

impact for t

he consumer, industrial, and automotive markets.

ROHM

Sensors

Strengths of

ROHM Group

Sensors

History

Supplying innovative sensor

products through technological

synergy across the entire group

Device Technologies

(Piezoelectric and MEMS)

●

IC AFE technology

●

Wafer bonding technology

●

Special materials

(piezoelectric elements,

gold, and platinum)

●

Optical filtering technology

Sensing Solutions

(Novel designs)

●

Wireless technology integration

●

Sensor technology fusion

●

Fitness applications and

support for the elderly

LSI AFE Technology

(High-precision analog technology)

●

High-precision analog technology

(Low-noise,

high-precision A/D converters, etc.)

●

Digital calibration technology

(Temperature compensation,

filtering technology, etc.)

Package Technology

(Compact types)

●

Chip scale packages (CSP)

●

Module packages

Sensor Catalog

Providing greater convenience, comfort, and safety

ROHM has developed a variety of sensor products based

on a wide range of technologies, from piezoelectric thin-film

deposition technology cultivated from high reliability

semiconductor expertise, silicon deep etching, and

multilayer filter technologies to wafer bonding and advanced

packaging technologies.

With the addition of LAPIS Semiconductor, a pioneer in

sensing processing technology, in 2008, and global MEMS

accelerometer supplier Kionix in 2009, the ROHM Group

has established itself as a market leader in the sensor field,

offering an u

nprecedented lineup.

ROHM's industry-leading lineup includes motion sensing

devices capable of accurately detecting position and

movement, environmental sensors offering real-time

detection of ambient conditions, interface devices optimized

for amplifying, analyzing, and processing sensor signals,

and MCUs designed to control multiple sensors - along with

short-range wireless communication ICs and modules that

support sub-GHz, Bluetooth

, and wireless LAN. Combining

these gives designers the freedom and flexibility to create

sensor-based applications that can detect and transmit a

variety of information, opening up new possibilities.

ROHM offers total solutions optim

ized to customer needs by

combining proprietary technologies and market-proven

expertise covering the entire manufacturing process, from

silicon ingots used as core materials to device development,

including algorithms and driver software along with control

ASICs and wireless communication modules.

Leveraging the combined resources of the entire Group will

allow ROHM to engage in CSR activities while pursuing

greater safety, efficiency, convenience, and environmental

impact for t

he consumer, industrial, and automotive markets.

ROHM

Sensors

Strengths of

ROHM Group

Sensors

History

Supplying innovative sensor

products through technological

synergy across the entire group

Device Technologies

(Piezoelectric and MEMS)

●

IC AFE technology

●

Wafer bonding technology

●

Special materials

(piezoelectric elements,

gold, and platinum)

●

Optical filtering technology

Sensing Solutions

(Novel designs)

●

Wireless technology integration

●

Sensor technology fusion

●

Fitness applications and

support for the elderly

LSI AFE Technology

(High-precision analog technology)

●

High-precision analog technology

(Low-noise,

high-precision A/D converters, etc.)

●

Digital calibration technology

(Temperature compensation,

filtering technology, etc.)

Package Technology

(Compact types)

●

Chip scale packages (CSP)

●

Module packages