Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
201038 Rev. A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • February 26, 2009
1
Skyworks De-embedded Scattering Parameters
White PaPer
Figure 1. Measurement System for S-Parameters
Introduction
An integral part of modern RF/microwave circuit design is
circuit simulation and evaluation in which scattering parameters
(S-parameters) for each element of a system are utilized to pre-
dict the overall small signal performance as the elements are
cascaded to form the entire system. The value and effectiveness
of these evaluations are directly related to the accuracy of the
S-parameters for each component, among other factors. This
paper describes the methodology employed by Skyworks to make
accurate S-parameter measurements for discrete RF/microwave
components.
Measurement of Scattering Parameters
Measurement of S-parameters is typically accomplished with a
vector network analyzer (VNA) , typically incorporating coaxial
transmission media and well-characterized short, open, load and
through (SOLT) coaxial calibration standards, most often sup-
plied by the VNA manufacturer. As a result, calibration is usually
accomplished only to the ends of the coaxial cables, and not to
the reference planes of the device under test, when these cali-
bration standards are utilized.
Most modern RF/microwave components are either surface-
mount-packaged devices or discrete chips, which are more
compatible with planar geometry transmission media such as
microstrip or coplanar waveguide (CPW) printed circuit board
transmission lines. In order to measure performance of a device
under test (DUT) in an environment which is similar to that in
which the component will typically be used, the DUT is generally
mounted on a microstrip or coplanar waveguide printed circuit
board test fixture. The performance of the printed circuit board
appears to alter the performance of the DUT and consequently
affects the measured data.
Network
Analyzer
Port 1 Port 2
DUT
Coaxial Cable
Microstrip or
CPW Test Fixture
In order to produce valid S-parameters for the DUT and accurate
simulation results, the effects of the test fixture must be removed
from the measured data. The process of removal of the test
fixture performance effects from measured S-parameter data
is known as “de-embedding.” De-embedded S-parameters for
Skyworks discrete components are available from www.skywork-
sinc.com.
The coaxial SOLT calibration standards are in most cases not
compatible with the surface-mount test fixturing utilized to char-
acterize devices. It is difficult to design and even more difficult to
verify, accurate microstrip or CPW calibration standards for use
in the SOLT calibration method, especially the open and short
standards. There are better ways to characterize a purpose-built
microstrip or CPW test fixture.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
February 26, 2009 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • 201038 Rev. A
white paper • SkyworkS De-embeDDeD Scattering parameterS
2
Transmission-Reflect-Through Calibration
Skyworks utilizes the through-reflect-line (TRL) calibration
method to calibrate the VNA/DUT test fixture system used to
make S-parameter measurements. This essentially removes the
effects, both phase and magnitude, of the DUT test fixture trans-
mission lines, test fixture coaxial connectors, etc.
The TRL method requires at least three calibration standards:
1. A through transmission line (T) with equal characteristic
impedance to that of the VNA and with a short electrical length
(defined as zero length);
2. A transmission line terminated at the DUT reference plane with
a large reflection coefficient magnitude (R), the exact value of
which is not critical, but with reasonably well-known phase
3. A transmission line (L) with equal characteristic impedance
to that of the VNA and electrical length which is at least
one-quarter wavelength longer than the T line at the center
frequency of the band of interest, with a known electrical
length.
Measurements made of the performance of these three calibra-
tion standards are sufficient to solve the 12-term error model
that describes the performance of multiple port VNAs. (Agilent
Product Note 8510-8A).
Skyworks characterization test fixtures are designed with trans-
mission lines which are equal in impedance and length on all
RF ports of the DUT, and equal in impedance and length to the
T standard described above. This allows the reference plane of
the VNA measurements to accurately be placed at the terminals
of the DUT. Consequently, all S-parameters, and in particular the
insertion loss and insertion phase of these transmission lines are
accurately “calibrated out” or de-embedded out of the measured
S-parameter data a priori.
Figure 2. A Typical Skyworks Characterization DUT Test Fixture
Figure 3. A Typical TRL/SOLT Calibration Standards Fixture
A characterization printed circuit board for a two port device
packaged in a 4 x 4 mm QFN package is shown in Figure 2.
This board has two main RF signal paths, labeled as “RF1” and
“RF2.” The remaining signal paths are used for control signals
and connection to a power supply. The goal is to remove the
effects of the test fixture RF transmission lines in order to obtain
the de-embedded S-parameters of the device under test (DUT).
Figure 3 shows an example of a TRL/SOLT standards printed
circuit board which was designed to be compatible with the
evaluation printed circuit board shown in Figure 2. The board in
figure 3 contains a through (T) transmission line and two reflect
(R) standards: a pair of identical shorted transmission lines; and,
a pair of identical open transmission lines. All of these lines were
designed to have the same characteristic impedance as the lines
RF1 and RF2 in Figure 2.
Some products, such as PIN diodes, tuning varactor diodes and
some amplifiers require the application of bias voltage or current
via a DUT RF port to perform their intended function. These sig-
nals are applied via the bias tees which are built into the VNA, so
any RF performance effects of these bias tees are also inherently
calibrated out of the performance measurement.
Other products, such as RF switches, digital attenuators, voltage
variable phase shifters, etc., have separate bias and/or power
supply terminals which are connected to non-RF traces. Many
of these products require DC blocking capacitors or other bias
components on their RF ports during operation. Therefore, these
components are designed into the characterization printed circuit
boards for such parts. Provisions are made in the TRL standards
to also include the same DC blocking capacitors in order to
remove the bias component performance effects from the DUT/
test fixture measurements.