1. ESD Protection ........................................................................................................................... 2

2. Printed Circuit Board Specifications ............................................................................................... 2

5. Applying Thermal Paste ............................................................................................................... 4

6. Mounting to the Heat Sink ........................................................................................................... 5

7. Creepage and clearance distances ................................................................................................ 6

8. Mounting to the Main Terminals.................................................................................................... 6

SEMiX press-fit modules are sensitive to electrostatic discharge (ESD), because discharge of this kind can

damage or destroy the devices. SEMiX modules are ESD protected in the shipment box by conductive

plastic trays. When handling and assembling the modules it is recommended to wear a grounded wrist

strap and to use a grounded workplace. All staff shall be trained for correct ESD handling.

The following recommendations for printed circuit boards (PCB) do not constitute a complete set of design

rules. The responsibility for proper design remains with the user of SEMiX press-fit modules.

Figure 1: PCB Specification

The main principle of the press-in technique is the bigger latitude of the press-in zone than of the PCB hole.

By the press-in process a plastic deformation of the pin results, ensuring a gas-tight and low-ohmic

resistance. Only small insertion forces are necessary with high holding forces at the same time.

The press-fitting can be done by using a toggle lever press or a machine. SEMIKRON offers 3D CAD models

of a suitable press-in tool as design help for a customer's tool (see Fig. 2). These may be requested at the