PROMGT.1027/ Rev.3/ Template Mounting Instruction

Page 1/14

Revision history ............................................................................................................................... 2

SEMITOP

2, 3, 4 with Press-Fit pins ............................................................................................ 3

PCB specifications ................................................................................................................. 3

1.1

Specification for components close to module pins .................................................................... 4

1.2

Matching the power module and the PCB ....................................................................................... 5

Press-in setup ....................................................................................................................... 5

2.1

Press-in process .................................................................................................................... 6

2.2

2.2.1

Basic requirements .......................................................................................................... 6

2.2.2

Press-in tool parameters .................................................................................................. 6

2.2.3

Press-in control parameters .............................................................................................. 6

Press-out setup ..................................................................................................................... 7

2.3

2.3.1

Press-out tool parameters ................................................................................................ 8

2.3.2

Press-out control parameters ............................................................................................ 8

Reworking of the assembly “module and PCB” .......................................................................... 9

2.4

Multiple per PCB .................................................................................................................... 9

2.5

Heatsink specifications and preparation ......................................................................................... 9

Module specifications ................................................................................................................ 10

Assembly ................................................................................................................................ 10

Thermal grease application ................................................................................................... 10

5.1

5.2

Standard thermal grease specification.................................................................................... 11

Assembling SEMITOP

Press-fit+PCB onto heatsink ................................................................. 11

5.3

ESD Protection ......................................................................................................................... 12

Caption of figures ..................................................................................................................... 13

Caption of tables ...................................................................................................................... 13

References .............................................................................................................................. 13

10.

Disclaimer ............................................................................................................................... 14

Mounting Instruction

SEMITOP2,3,4

Press-Fit

Revision: 03

Issue date: 2017-08-28

Prepared by: Roberto Agostini

Approved by: Werner Obermaier

Keyword: SEMITOP, mounting instructions, one screw mounting,

no baseplate, press-fit pins, 12mm height, thermal paste,

assembly, torque, washer, screw, heatsink.