Microchip Technology Incorporated 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Main Office 480-792-7200
Fax 480-899-9210
Micrel San Jose CA (SJ) to Microchip Colorado
Springs CO (MCSO) Fab Transfer of SiGe
Frequently Asked Questions (FAQ)
March 30, 2017
Why is Microchip making this change? The Micrel 6 inch
fabrication facility in San Jose is closing. The Microchip 6 inch
fabrication facility located at Colorado Springs CO, USA will
provide more capacity that will ensure continuity of supply.
Microchip’s fabrication sites have improved defect
control/inspections and more efficient/diversified fab equipment.
What is and what is not changing?
Pre Change
Post Change
Fabrication
Location
Micrel Fabrication Site
(San Jose, CA, USA)
Primary Fab Location:
Atmel Fabrication site FAB
5 (Colorado Springs, CO
USA)
Secondary Fab
Location:
Microchip Fabrication
Site (Tempe, AZ USA)
Wafer Diameter
6 inches (150 mm)
6 inches (150 mm)
8 inches (200 mm)
Quality certification
ISO9001
ISO9001/TS16949
ISO/TS16949
Data sheet /
specifications
No Change
No Change
No Change
Design/layout
No Change
No Change
No Change
Die Size
No change
No change
No change
Final test program
No change
No change
No change
Package Type/MSL
No Change
No Change
No Change
Why is Microchip qualifying the MCSO 6” location in
addition to the 8” locations for the SiGe process technology?
The reason the MCSO 6” location is being qualified is because
the fabrication equipment/processes are a better match between
the SJ and MCSO fab and will provide better efficiencies for
sustaining inventories of SiGe products. While the 8” locations
will provide a suitable backup location to ensure inventory
levels can keep up with demand.
What products are affected and what is the notification
strategy? Microchip has identified the parts affected and is
implementing a notification strategy with a three phase
Product/Process Change Notice (PCN) approach.
Phase 1: Microchip will issue an initial PCN. The PCN
number is PCN # JAON-29XUTR452 and it will include
the following information:
a. Qualification plan.
b. Anticipated quarter and year for availability of the
qualification report.
c. Affected parts list
Phase 2: Microchip will issue an intermediate PCN after
qualification has completed. Included in this PCN is:
a. Qualification report
b. Complete list of Catalog Part Numbers (CPN) for
the qualified SiGe process technology.