Microsemi Corporation
One Enterprise, Aliso Viejo, CA 92656 USA
Within the USA: +1 (800) 713-4113 Outside the USA: +1 (949) 380-6100 Fax: +1 (949) 215-4996 Email: sales.support@microsemi.com. www.microsemi.com
MSC-F-0003 Rev 4 Do Not Distribute Outside Microsemi Without Written Permission Page 1 of 5
Microsemi Corporation
November 17, 2017
Product/Process Change Notification No: PCN17035A
Change Classification: Minor
Subject: BGA Devices with Halogenated Substrates Will Change to Halide-free
Substrate Material (Addendum A)
Description of Change:
Devices in BGA packages that use halogenated substrates will use halide-free (green)
substrates. Solder masks will also change.
Addendum A: Additional affected devices listed at end of Appendix A.
Reason for Change:
The substrate material supplier will discontinue production of halogenated (non-green) core and
pre-preg materials by the end of 2017.
The replacement halide-free material is already qualified and has been running in volume
production on other Microsemi SoC and FPGA BGA products for more than five years.
Table 1: Material Changes
From
To
Core and Pre-preg
CCL-HL3832
CCL-HL832NX-A
CCL-HL832HS
CCL-HL832NX-A
Solder mask
TAIYO AUS5, or
AUS303
AUS308, or
AUS320
Application Impact:
There is no impact on form, fit, function, or reliability of the device. The datasheet and package
specifications remain the same.
Products Affected by this Change:
See Appendix A for the complete list of affected devices.
Microsemi Corporation
One Enterprise, Aliso Viejo, CA 92656 USA
Within the USA: +1 (800) 713-4113 Outside the USA: +1 (949) 380-6100 Fax: +1 (949) 215-4996 Email: sales.support@microsemi.com. www.microsemi.com
MSC-F-0003 Rev 4 Do Not Distribute Outside Microsemi Without Written Permission Page 2 of 5
Production Shipment Schedule:
Microsemi may begin shipping the devices with the halide-free substrates beginning
December 20, 2017.
After December 20, 2017, customers may receive a mix of halogenated substrates and halide-
free substrates.
Qualification Data:
Halide-free substrate material has been used for all Microsemi SoC and FPGA BGA package
device qualifications for at least five years. Qualification information is available upon request.
Contact Information:
If you have further questions about this subject, contact Microsemi’s Technical Support
at soc_tech@microsemi.com.
Regards,
Microsemi Corporation
Any projected dates in this PCN are based on the most current product information at the time this PCN is
being issued, but they may change due to unforeseen circumstances. For the latest schedule and any
other information, please contact your local Microsemi Sales Office, the factory contact shown above, or
your local distributor.
This Product/Process Change Notification is confidential and proprietary information of Microsemi and is
intended only for distribution by Microsemi to its customers, for customers’ use only. It must not be copied
or provided to any third party without Microsemi's prior written consent.