SGM2578
Ultra Small, Low Input Voltage,
Low R
ON
Load Switch
SG Micro Corp
www.sg-micro.com
AUGUST 2018 REV. A. 4
GENERAL DESCRIPTION
The SGM2578 is an ultra small, low R
ON
load switch
with controlled turn on. The device contains an
N-channel MOSFET that operates over an input
voltage range of 1V to 5V. The switch is controlled by
EN pin, which is capable of interfacing directly with low
voltage control signals.
SGM2578 device limits the output current to a safe
level by using a constant current mode when the output
load exceeds the current-limit threshold. An internal
reverse voltage comparator disables the power switch
when the output voltage is driven higher than the input
to protect devices on the input side of the switch.
The SGM2578 is available in Green WLCSP-0.9×0.9-4B
package and operates over a temperature range of
-40 to +85.
FEATURES
Low Input Voltage: 1V to 5V
Ultra-Low On-State Resistance (R
ON
)
R
ON
= 54at V
IN
= 5.0V
R
ON
= 54at V
IN
= 3.6V
R
ON
= 58at V
IN
= 2.5V
R
ON
= 74at V
IN
= 1.8V
R
ON
= 84at V
IN
= 1.2V
R
ON
= 84at V
IN
= 1.0V
1A Maximum Continuous Switch Current
Quiescent Current: 5μA (TYP)
Shutdown Current: < 1.5μA
Low Control Input Thresholds Enable Use of
Low-Voltage Logic
Controlled Slew Rate to Avoid Inrush Currents
Quick Output Discharge (QOD)
Evaluated to IEC 60950-1, Ed 2, Am1, Annex CC,
Test Program 1 with CB Report
Available in Green WLCSP-0.9×0.9-4B Package
APPLICATIONS
Battery Powered Equipment
Portable Industrial Equipment
Portable Medical Equipment
Portable Media Players
Point of Sales Terminal
GPS Devices
TYPICAL APPLICATION
V
OUT
V
IN
EN
GND
C
IN
C
L
Power
Supply
SGM2578
R
L
ON
OFF
Figure 1. Typical Application Circuit
Ultra Small, Low Input Voltage,
SGM2578 Low R
ON
Load Switch
2
AUGUST 2018
SG Micro Corp
www.sg-micro.com
PACKAGE/ORDERING INFORMATION
MODEL
PACKAGE
DESCRIPTION
SPECIFIED
TEMPERATURE
RANGE
ORDERING
NUMBER
PACKAGE
MARKING
PACKING
OPTION
SGM2578 WLCSP-0.9×0.9-4B
-40 to +85
SGM2578YG/TR K2 Tape and Reel, 3000
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If
you have additional comments or questions, please contact your SGMICRO representative directly.
ABSOLUTE MAXIMUM RATINGS
Input Voltage Range, V
IN
................................ -0.3V to +5.5V
Output Voltage Range, V
OUT
.................. -0.3V to (V
IN
+ 0.3V)
EN Voltage Range, V
EN
.................................. -0.3V to +5.5V
Maximum Continuous Switch Current, I
MAX
V
IN
≥ 1.2V .................................................................. 1000mA
V
IN
= 1.0V ................................................................... 600mA
Package Thermal Resistance
WLCSP-0.9×0.9-4B, θ
JA
.......................................... 188/W
Junction Temperature ................................................. +150
Storage Temperature Range ......................... -65 to +150
Lead Temperature (Soldering, 10s) ............................ +260
ESD Susceptibility
HBM ............................................................................. 2000V
MM ................................................................................. 300V
RECOMMENDED OPERATING CONDITIONS
Operating Temperature Range ....................... -40 to +85
Input Voltage Range, V
IN
........................................... 1V to 5V
EN Voltage Range, V
EN
............................................. 0V to 5V
Output Voltage Range, V
OUT
.................................... 0V to V
IN
OVERSTRESS CAUTION
Stresses beyond those listed in Absolute Maximum Ratings
may cause permanent damage to the device. Exposure
to
absolute maximum rating conditions for extended periods
may affect reliability. Functional operation of the device at any
conditions beyond those indicated in the Recommended
Operating Conditions section
is not implied.
ESD SENSITIVITY CAUTION
This integrated circuit can be damaged by ESD if you don’t
pay attention to ESD protection. SGMICRO recommends that
all integrated circuits be handled with appropriate precautions.
Failure to observe proper handling and installation
procedures can cause damage. ESD damage can range from
subtle performance degradation to complete device failure.
Precision integrated circuits may be more susceptible to
damage because very small parametric changes could cause
the device not to meet its published specifications.
DISCLAIMER
SG Micro Corp reserves the right to make any change in
circuit
design, or specifications
without prior notice.