No. Part Name Material Name
Component wt
(mg)
Material Content
(Element)
CAS Number
Element wt
(%)
Element wt
(mg)
PPM
E-Glass Fabric 65997-17-3
10.00% 10.800 100000
Epoxy Resin 29690-82-2
6.88% 7.425 68750
Fillers 60676-86-0
5.38% 7.425 53750
Phosphorous Flame Retardant 35948-25-5
1.25% 1.350 12500
Copper 7440-50-8
25.00% 13.591 250000
Barium Sulfate 7727-43-7
7.40% 1.304 74000
3-Methoxy-3-methylbutylacetate 103429-90-9
2.75% 0.485 27500
Dipropylene Glycol Monomethyl Ether 34590-94-8
4.00% 0.705 40000
Talc containing no asbestiform fibers 14807-96-6
0.25% 0.044 2500
Morpholine derivative Trade Secret
0.25% 0.044 2500
Solvent naphtha(petroleum), Heavy arom 64742-94-5
0.25% 0.044 2500
2,4,6-Triamino-1,3,5-Triazine 108-78-1
0.25% 0.044 2500
Silicon dioxide 7631-86-9
0.03% 0.004 250
Diethylene Glycol Monoethyl Ether Acetate 112-15-2
0.03% 0.004 250
Naphthalene 91-20-3
0.03% 0.004 250
Trimethylbenzene 108-67-8
0.03% 0.004 250
Epoxy Resin (MW≦700)
9003-36-5
7.50% 1.322 75000
Dipentaerythritol hexaacrylate 29570-58-9
1.50% 0.264 15000
Dipentaerythritol pentaacrylate 60506-81-2
0.75% 0.132 7500
Nickel 7440-02-0
22.26% 1.193 222600
Gold 7440-57-5
3.72% 0.142 37200
Copper 7440-50-8
0.52% 6.795 5200
Epoxy resin 9003-36-5
5.00% 2.829 50000
2,2'-((2,2',5,5'-tetramethy-(1,1'-biphenyl)-4,4'-diyl)-bis(oxymethylene))-bis-oxirane 85954-11-6
5.00% 2.829 50000
Hardener Trade Secret
5.00% 2.829 50000
Carbon Black 1333-86-4
0.20% 0.113 2000
Amorphous Silica 1 60676-86-0
80.80% 45.720 808000
Amorphous Silica 2 7631-86-9
4.00% 2.263 40000
2-(2-Ethoxyethoxy)ethyl acetate 112-15-2
36.50% 1.110 365000
Butadiene, acrylonitrile polymer, carboxy-terminated, polymer with bisphenol A and epichlorohydrin 68610-41-3
28.00% 0.851 280000
Isodecyl alcohol, ethoxylated 61827-42-7
10.00% 0.304 100000
Silica Filler 112926-00-8
25.00% 0.760 250000
Tert-butyl peroxyneodecanoate 26748-41-4
0.50% 0.015 5000
Tin 7440-31-5
96.49% 26.560 964920
Silver 7440-22-4
3.00% 0.826 30000
Copper 7440-50-8
0.50% 0.138 5000
Germanium 7440-56-4
0.01% 0.002 80
5 Gold Wire Au 0.271
Gold 7440-57-5
100.00% 0.271 1000000
6 Die Chip 35.57
Silicon 7440-21-3
100.00% 35.570 1000000
176.118 600.00% 176.118
6000000
3
4
Epoxy
Solder ball
6202C
SnAgCu
176.118mg
53.127
56.584
3.04
27.526
Part Number:
Part Weight:
Substrate
Mold compound
HL-832NX-A / AUS 308
CEL-9120HF
1
2
Alliance Memory Inc.
12815 NE 124th Street Suite D Kirkland, WA 98034
Tel: 425-898-4456
Fax: 425-896-8628 Alliance Memory Inc. reserves the right to change
products or specification
without notice
ALLIANCE MEMORY MDS REPORT
AS4C1G8D4A-62BCN / AS4C1G8D4A-62BIN