PCB High Density Connectors
MHD / MDD / MDP
Connectors Series
Hypertac
®
Hyperboloid
Technology
Smiths Interconnect offers an extensive range of superior contact technologies suitable for standard
and custom solutions. Hypertac
®
(HYPERboloid conTACt) is the original superior performing
hyperboloid contact technology designed for use in all applications and in harsh and
demanding environments where high reliability and safety are critical. The
inherent electrical and mechanical characteristics of the Hypertac
hyperboloid contact ensures unrivaled performance in
terms of reliability, number of mating cycles,
low contact force and minimal contact
resistance. The shape of the contact sleeve
is formed by hyperbolically arranged contact
wires, which align themselves elastically as
contact lines around the pin, providing a
number of linear contact paths.
Features Benefits
Low insertion/extraction forces
The angle of the socket wires allows tight control of the pin insertion
and extraction forces. The spring wires are smoothly deflected to
make line contact with the pin.
High density interconnect systems
Significant reductions in size and weight of sub-system designs.
No additional hardware is required to overcome mating and un-
mating forces.
Long contact life
The smooth and light wiping action minimizes wear on the contact
surfaces. Contacts perform up to 100,000 insertion/extraction
cycles with minimal degradation in performance.
Low cost of ownership
The Hypertac contact technology will surpass most product
requirements, thus eliminating the burden and cost of having to
replace the connector or the entire subsystem.
Lower contact resistance
The design provides a far greater contact area and the wiping action
of the wires insures a clean and polished contact surface. Our
contact technology has about half the resistance of conventional
contact designs.
Low power consumption
The lower contact resistance of our technology results in a lower
voltage drop across the connector reducing the power consumption
and heat generation within the system.
Higher current ratings
The design parameters of the contact (e.g., the number, diameter
and angle of the wires) may be modified for any requirement.
The number of wires can be increased so the contact area is
distributed over a larger surface. Thus, the high current carried by
each wire because of its intimate line contact, can be multiplied
many times.
Maximum contact performance
The lower contact resistance of the Hypertac contact reduces
heat build-up; therefore Hypertac contacts are able to handle
far greater current in smaller contact assemblies without the
detrimental effects of high temperature.
Immunity to shock & vibration
The low mass and resultant low inertia of the wires enable them
to follow the most abrupt or extreme excursions of the pin without
loss of contact. The contact area extends 360° around the pin and
is uniform over its entire length. The 3 dimensional symmetry of
the Hypertac contact design guarantees electrical continuity in all
circumstances.
Reliability under harsh environments
Harsh environmental conditions require connectors that will
sustain their electrical integrity even under the most demanding
conditions such as shock and vibration. The Hypertac contact
provides unmatched stability in demanding environments when
failure is not an option.
Contents
MHD Series
Technical characteristics ............................................................................................................. 2
How to order ............................................................................................................................ 3
Modules configuration ................................................................................................................ 4
Standard plugging stages ............................................................................................................ 5
Termination styles ..................................................................................................................... 6
Connector dimensions ................................................................................................................ 7
Guiding devices ....................................................................................................................... 13
Contact board preparation details ................................................................................................ 14
Power and high frequency contacts .............................................................................................. 18
MDD Series
Technical characteristics ............................................................................................................ 19
How to order .......................................................................................................................... 20
Modules configuration ............................................................................................................... 21
Standard plugging stages ...........................................................................................................22
Termination styles ....................................................................................................................23
Connector dimensions ...............................................................................................................24
Guiding devices .......................................................................................................................25
Contact board preparation details ................................................................................................26
MDP Series
Technical characteristics ............................................................................................................27
How to order ...........................................................................................................................28
Connector dimensions ...............................................................................................................29
Guide and termination styles ..................................................................................................... 30
Contact board preparation details ................................................................................................ 31
1
MHD/MDD/MDP Series