e MMC5.1 Datasheet

- 2 -

TABLE OF CONTENTS

1 Introduction ......................................................................................................................................... - 3 -

1.1 General Description .............................................................................................................................. - 3 -

1.2 Product List .............................................................................................................................................- 3 -

1.3 Key Feature..............................................................................................................................................- 3 -

2 Package Configurations ...................................................................................................................- 5 -

2.1 153-FBGA Ball Array View ................................................................................................................... - 5 -

2.2 Ball Assignment.......................................................................................................................................- 6 -

2.3 Package Dimensions ............................................................................................................................ - 6 -

2.4 Product Architecture............................................................................................................................... - 7 -

3 e.MMC Features ..................................................................................................................................- 8 -

3.1 HS400 mode ...........................................................................................................................................- 8 -

4 e.MMC 5.1 Features ...........................................................................................................................- 9 -

4.1 Overview ................................................................................................................................................. - 9 -

4.2 Command Queuing ................................................................................................................................- 9 -

4.2.1 CMD Set Description ................................................................................................................................. - 9 -

4.2.2 New Response: QSR (Queue Status Register) ................................................................................- 10 -

4.2.3 Send Status: CMD13............................................................................................................................... - 10 -

4.2.4 Mechanism of CMD Queue operation

.................................................................................................

- 10 -

4.2.5 CMD Queue Register description......................................................................................................... - 10 -

4.3 Enhanced Strobe Mode ......................................................................................................................- 11 -

4.4 RPMB Throughput improve................................................................................................................ - 11 -

5 Usage Overview

................................................................................................................................

- 12 -

5.1 General Description ............................................................................................................................ - 12 -

5.2 Partition Management .........................................................................................................................- 12 -

5.3 User Density.......................................................................................................................................... - 13 -

5.4 Performance.......................................................................................................................................... - 14 -

5.5 Boot Operation Mode .......................................................................................................................... - 15 -

6 Device Register .................................................................................................................................- 16 -

6.1 OCR Register ....................................................................................................................................... - 16 -

6.2 CID Register.......................................................................................................................................... - 16 -

6.3 CSD Register ....................................................................................................................................... - 16 -

6.4 Extended CSD Register ......................................................................................................................- 18 -

7 AC Parameter..................................................................................................................................... - 23 -

7.1 Timing Parameter................................................................................................................................. - 23 -

7.2 Bus Timing Parameters for DDR52 and HS200 are defined by JEDEC standard ................... - 23 -

7.3 Bus Timing Specification in HS400 mode........................................................................................ - 24 -

7.3.1 HS400 Device Input Timing ................................................................................................................... - 24 -

7.3.2 HS400 Device Output Timing ................................................................................................................- 25 -

7.4 Bus Signal Levels................................................................................................................................. - 26 -

7.4.1 Open-Drain Mode Bus Signal Level .................................................................................................... - 26 -

7.4.2 Bus Signal Level (High-Voltage)

............................................................................................................

- 26 -

7.5 H/W Reset Operation .......................................................................................................................... - 27 -

7.6 Power-up sequence ............................................................................................................................ - 28 -

8 DC Electrical Characteristics

........................................................................................................

- 28 -

8.1 Power Supply Voltage .........................................................................................................................- 28 -

8.2 Operating Current (RMS) ................................................................................................................... - 28 -

8.3 Standby Power Consumption ............................................................................................................- 29 -

8.4 Sleep Power Consumption..................................................................................................................- 29 -

8.5 Bus Signal Line Load........................................................................................................................... - 30 -