AZEV132
ZETTLER
www.ZETTLER-group.com page 2 of 3 2023-11-02
Example ordering data
AZEV132-1AE-24D Without signal contact, 24 VDC coil
AZEV132-1AE1BG-12D With 1 Form B signal contact, 12 VDC coil
ORDERING DATA
AZEV132-1AE - D
Nominal coil voltage
see coil voltage specifications table
Signal contact
nil: without signal contact
1BG: equipped with 1 Form B signal contact
Layout and footprint recommendation. Viewed towards terminals. Dimensions in mm.
Note: * Pins only present at versions with signal contact.
COIL VOLTAGE SPECIFICATIONS
Nominal Coil
VDC
Must Operate
VDC
Min. Holding
VDC
Max. Coil
VDC
Resistance
Ohm ± 10%
5 3.75 1.75 6.0 16.15
9 6.75 3.15 10.8 52.3
12 9.0 4.2 14.4 93.0
24 18.0 8.4 28.8 372
48 36.0 16.8 57.6 1488
Test conditions: 23°C (73°F), upright position, terminals downward.
Dimensions in mm. Tolerance: ±0.3 mm if not stated otherwise.
Pin dimensions given without tin coating.
Note: * Pins only present at versions with signal contact.
MECHANICAL DATA
CAD data in attachment of the datasheet.
PC BOARD LAYOUT / WIRING DIAGRAMS
NOTES
1. All values at reference temperature of 23°C (73°F) unless stated
otherwise.
2. Relay may pull in with less than “Must Operate” value.
3. “Maximum Coil Voltage” is the maximum voltage the coil can endure for
a short period of time.
4. Coil suppression circuits such as diodes, etc. in parallel to the coil will
lengthen the release time. We recommend to use coil suppression
circuits with a reverse breakdown voltage of around 3 times the nominal
coil voltage to achieve a fast release time.
5. For applications requiring long term high current carrying, we
recommend to reduce the coil energization to around half of the
nominal coil voltage as holding voltage.
6. For the gold plated signal contact a minimum load of 10mA/5V/50mW is
recommended.
7. Provide sufficient PCB cross section at Form A load terminals as a heat
spreader to dissipate power loss form contact resistance.
8. Relay adjustment may be affected if excessive shock is applied to the
relay or if undue pressure is exerted on the relay case. Dropped relays
must not be used anymore.
9. For automated dual wave soldering process we recommend preheating
with 120°C (248°F) for max. 120 seconds and a soldering temperature
of 260 ±5°C (500 ±9°F) for max. 10 seconds soldering time (max. 5
seconds per wave). For manual soldering we recommend 350°C
(662°F) max. temperature for max. 5 seconds. During the soldering
process, no force may be exerted on the relay terminals.
10. RTII (flux proof) relays must not be washed, immersion cleaned or
conformal coated.
11. During storage, transport and usage, ensure a dry, non-condensing and
non-icing environment.
12. Substances containing silicone or phosphorus must be avoided in the
vicinity to the relay as these will shorten its service life.
13. Avoid corrosive gases near the relay. Contact corrosion will lead to
malfunction.
14. Specifications subject to change without notice.
Compliance with IEC 62752, IEC 62955 or similar standards for short
circuit withstand is a function of both relay design and PCB layout.
ZETTLER's relay design and applications engineering teams have
developed an application note that contains important design suggestions
to optimize the performance of the relay with respect to its short circuit
current withstand capability.
In addition, as the overall performance depends on multiple factors such as
part arrangement and trace routing, compliance cannot be generically
guaranteed by ZETTLER. We strongly encourage customers to conduct
their own short circuit tests in accordance with IEC 62752, IEC 62955 or
similar standards in the context of their individual application design.
IEC 62752 / IEC 62955 Short Circuit Withstand