Material Composition Declaration
Company Name Issue Date: 11/29/2023
Contact Name: Contact Title:
VP Quality
Contact Phone: Contact Email:
yanping.ma@epc-co.com
Part Weight: Type of Product: eGaN FET
Weight
Mass Sum Mass
(mg) (%) (%) (ppm)
Silicon 7440-21-3
4.3503 80.7779 807779
Silicon oxide 7631-86-9
0.0186 0.3450 3450
Silicon nitride 12033-89-5
0.0079 0.1465 1465
Gallium nitride 25617-97-4
0.0181 0.3355 3355
Aluminum 7429-90-5
0.0440 0.8167 8167
Aluminum nitride 24304-00-5
0.0028 0.0516 516
Titanium 7440-32-6
0.0009 0.0166 166
Titanium nitride 25583-20-4
0.0039 0.0720 720
Copper 7440-50-8
0.0007 0.0136 136
Tungsten 7440-33-7
0.0014 0.0256 256
Polyimide
0.0325 0.6040 6040
Titanium 7440-32-6
0.0007 0.0125 125
Copper 7440-50-8
0.0067 0.1241 1241
Solder Bump Copper 7440-50-8
0.0669 1.2413 12413
Nickel
7440-02-0 0.0399 0.7405 7405
Tin 7440-31-5
0.7762 14.4124 144124
Silver 7440-22-4
0.0142 0.2642 2642
Sum in total: 5.3856 100.0000 100.0000 1000000
Construction
Element
Substance
CAS No.
If Applicable
Chip
83.2050
Under Bump Metal
0.1366
16.6584
5.4 mg
EPC2619
Efficient Power Conversion (EPC)
Yanping Ma
(310) 615-0280
Note:
The substance content disclosed herewith is approximate and is based on engineering calculation. Statements are based on our present
knowledge and may subject to change at any time due to technical requirements and development. EPC may update this document without
notification. Statement may not include information regarding the minute quantities of dopant and metal materials in the electrical devices