Chomerics
Electrically Conductive
Specialty Materials Selector Guide
Coatings, Adhesives, Sealants, Gap Fillers, and Greases
ENGINEERING YOUR SUCCESS.
Product Filler
Resin Type (Parts)
Mix Ratio by Weight
Specific
Gravity
1
Max. Surface
Resistance
1
@
(Rec. Thickness
2
)
ohm/sq. (mils)
Min/Max.
Use Temp.
°C (°F)
Elevated Cure
Schedule
Time @ °C (°F)
RT Cure
Schedule
Time
Working
Life
Hours
Shelf Life
Months
3
Theoretical Coverage @
Rec. Thickness
2
ft
2
/gram (m
2
/gram)
VOC
4
g/L
Typical Application Comments
2044* Ni Acrylic (1) 1.2 1.000 (2)
-40/85
(-40/185)
0.25 hr. @ 21 (70) +
0.75 hr. @ 66 (150)
24 hr. Unlimited 9 0.034 (0.0032) 755
EMI shielding of electronic enclosures and
assemblies
Durable coating. Nickel filler provides some
H-field shielding
2056*
Ag/Cu
& Ag
Acrylic (1) 1.1 0.030 (1)
-40/85
(-40/185)
0.25 hr. @ 21 (70) +
0.5 hr. @ 66 (150)
24 hr. Unlimited 12 0.062 (0.0058) 718
EMI shielding of electronic enclosures and
assemblies
Most cost effective EMI shielding solution for
electronic enclosures
2040* Ag Acrylic (1) 1.2 0.025 (1)
-40/85
(-40/185)
0.25 hr. @ 21 (70) +
0.5 hr. @ 66 (150)
24 hr. Unlimited 12 0.065 (0.0060) 741
EMI shielding of electronic enclosures and
assemblies
Silver filler provides antimicrobial resistance
and excellent EMI shielding
610* Ag/Cu
Epoxy (3)
A:B:C
100: 42.4: 50
1.2 0.150 (2)
-65/125
(-85/257)
2 hr. @ 21 (70) +
1 hr. @ 66 (150) +
1 hr. @ 121 (250)
1 week 8.0 9 0.051 (0.0047) 591
Man portable electronics, radar systems,
missile cannisters
Maintains electrical and mechanical stability
in harsh environments
571* Ag
Epoxy (2)
A:B 100:8.3
1.3 0.010 (1)
-40/125
(-40/257)
15 min. @ 21 (70) +
1 hr. @ 121 (250)
None 12.0 9 0.060 (0.0056) 308
Component level EMI shielding of semicon-
ductor devices
Good adhesion to semiconductor packages.
Withstands wave solder temperatures
576* Ag
Epoxy (2)
A:B 100:27.5
1.7 0.060 (1)
-40/150
(-40/302)
1 hr. @ 21 (70) +
1 hr. @ 121 (250)
1 week 8.0 9 0.092 (0.0085) 560
Electroplating over plastics and graphite
composites
Provides a conductive seed layer for electro-
plating
596* Ag
Epoxy (2)
A:B 100:37.2
1.8 0.060 (1)
-40/150
(-40/302)
1 hr. @ 21 (70) +
1 hr. @ 121 (250)
1 week 8.0 9 0.098 (0.009) 585
Man portable electronics, radar systems,
missile cannisters
Meets military specification MIL-C-22750,
CHO-SHIELD 579 is a low VOC version of
CHO-SHIELD 596
608* Ag Polyester (1) 1.4 0.015 (0.5)
-40/125
(-40/257)
0.25 hr. @ 21 (70) +
0.5 hr. @ 121 (250)
None Unlimited 9 0.099 (0.0092) 711
EMI shielding of electronic enclosures and
assemblies
Flexible coating, great for covering parts with
difficult geometries
604* Ag Polyurethane (1) 1.2 0.010 (1)
-40/125
(-40/257)
0.25 hr. @ 21 (70) +
0.25 hr. @ 150 (302)
None Unlimited 9 0.034 (0.0032) 767
Component level EMI shielding of semicon-
ductor devices
Advanced coating developed for high volume,
precise spray application on semiconductor
packages
4994* Ag
Polyurethane (4)
A:B:C:D
100:18.3:
1.4:20.9
2.3 0.075 (3)
-40/85
(-40/185)
2 hr. RT & 40-60% RH +
2 hr. @ 54 (130)
1 week 3.0 6 0.030 (0.0028) 596 Airframes
Very smooth and very conductive; long pot
life, excellent sprayability
2001* Cu
Polyurethane (3)
A:B:C 100:10.1:42.0
1.6 0.100 (3)
-65/85
(-85/185)
2 hr. @ 21 (70) +
0.5 hr. @ 121 (250)
1 week 2.0 9 0.035 (0.0033) 543 Corrosion protection for airframes Requires use of CHO-SHIELD 1091 primer
2002* Cu
Polyurethane (3)
A:B:C 100:10.3:42.2
1.6 0.100 (3)
-65/85
(-85/185)
2 hr. @ 21 (70) +
0.5 hr. @ 121 (250)
1 week 2.0 9 0.035 (0.0033) 540 Corrosion protection for airframes
Chromate free. Requires use of CHO-SHIELD
1091 primer
2003* Cu
Polyurethane (3)
A:B:C 100:10.1:42.0
1.6 0.100 (3)
-65/85
(-85/185)
2 hr. @ 21 (70) +
0.5 hr. @ 121 (250)
1 week 2.0 9 0.036 (0.0033) 541 Corrosion protection for airframes Requires use of CHO-SHIELD 1091 primer
CHO-SHIELD
®
Electrically Conductive Paints and Coatings
Chomerics
ENGINEERING YOUR SUCCESS.
Product Filler
Resin Type (Parts)
Mix Ratio by Weight
Specific
Gravity
1
Max. Vol.
Resistivity
1
ohm-cm
Min/Max.
Use Temp.
°C (°F)
Min. Lap
Shear
1
psi (kPa)
Elevated Cure
Schedule
Time @ °C (°F)
RT Cure
Schedule
Time
Working
Life
Hours
Shelf Life
Months
3
VOC
4
g/L
Typical Application Comments
CHOBOND
4660*
Ag/Cu Polyisobutylene (1) 2.0** 0.080
-55/100
(-67/212)
n/a None 1 week
5
0.5 6 305 Sealing enclosure seams
Superior performance in vibration or shear. For
vertical seams or longer (120 minutes) working life,
use CHO-BOND 4669 VOC = 340.
TECKNIT
0005*
Ag/glass Polyolefin (1) 1.7 0.005
-54/94
(-65/200)
4
(28)
None 24 hr. 5 min 9 419 Bonding enclosures Flexible thixotropic cream system
CHOBOND
2165*
Cu
Polyurethane (2)
A:B 100:7
2.9 0.010
-65/85
(-85/185)
120
(827)
2 hr @ 21 (70)
+ 0.25 hr. @ 113 (235)
1 week
5
1.0 9 207 Airframe form-in-place sealing Corrosion resistant; paintable
TECKNIT
0002
Ag Silicone (1) 3.1 0.010
-59/204
(-75/400)
150
(1034)
None 72 hr. 5 min 5.5 31 Bonding elastomer gaskets
Rec. bond line thickness:
0.005” - 0.25“ (- 0.13 mm - 6.35 mm);
flexible paste; Handling time 24 hours.
CHO-BOND
1016*
Ni/C Silicone (1) 2.4 0.500
-55/125
(-67/257)
150
(1034)
None 1 week
5
0.5 6 0
Ideal in outdoor applications for EMI
shielding and low corrosion
Rec. bond line thickness:
> 0.007” (0.18 mm);
Primer promotes adhesion.
Recommended primer is 1086
CHOBOND
1038*
Ag/Cu Silicone (1) 3.6 0.010
-55/125
(-67/257)
150
(1034)
None 1 week
5
0.5 6 111
Sealing enclosure seams;
airframe gap sealing;
connector shielding
Rec. bond line thickness:
> 0.007” (0.18 mm); Primer promotes adhesion.
Recommended primer is 1086
CHO-BOND 1121 is a solvent free version with a 12
month shelf life
CHOBOND
1075*
Ag/Al Silicone (1) 2.0 0.010
-55/200
(-67/392)
100
(689)
None 1 week
5
0.25 6 0 Sealing enclosure seams
Rec. bond line thickness: > 0.010” (0.25 mm)
Primer promotes adhesion
Recommended primer is 1086
CHOBOND
1035*
Ag/glass Silicone (1) 1.9 0.050
-55/200
(-67/392)
100
(689)
None 1 week
5
0.5 6 160 Sealing enclosure seams
Rec. bond line thickness: > 0.007” (0.18 mm)
Primer promotes adhesion
Recommended primer is 1086
CHOBOND
1019*
Ag/Al Polythioether (2) 2.15 0.010
-62/160
(-80/320)
65
(448)
None 1 week
5
2 6 @ -40°C 124 Sealing enclosure seams
Packaged in a pre-measured kit. No weighing
required, mix and dispense in same package,
minimizes process scrap.
CHO-BOND
®
and
TECKNIT
TM
Electrically Conductive Sealants/Gap Fillers
Chomerics
ENGINEERING YOUR SUCCESS.