STRESS ABV REF.NO. TEST BEFORE AND AFTER STRESS
SAMPLE
SIZE / LOT
NUMBER
OF LOTS
ACCEPT
CRITERIA
JUDGMENT
Preconditioning PC A1 25°C 231 3 0 Fails PASS Generic:R1580N
Temperature-Humidity-Bias
or Biased HAST
THB or
HAST
A2 25℃,125℃ 77 3 0 Fails PASS Generic:R1580N
Unbiased HAST or
Temperature-
Humidity(without Bias)
UHAST
or TH
A3 25°C 77 3 0 Fails PASS Generic:R1580N
Temperature Cycling TC A4 125℃ 77 3 0 Fails PASS Generic:R1580N
Power Temperature Cycle PTC A5 25℃,125℃ 45 1 0 Fails PASS Generic:R1580N
High Temperature Storage
Life
HTSL A6 25℃,125℃ 45 1 0 Fails PASS Generic:R1580N
STRESS ABV REF.NO. TEST BEFORE AND AFTER STRESS
SAMPLE
SIZE / LOT
NUMBER
OF LOTS
ACCEPT
CRITERIA
JUDGMENT
High Temperature
Operating Life
HTOL B1 -40℃,25℃,125℃ 77 3 0 Fails PASS
Early Life Failure Rate ELFR B2 25℃,125℃ 800 3 0 Fails PASS Generic:R1580N
NVM Endurance,
Data Retention, and
Operational Life
EDR B3 25℃,125℃ 77 3 - -
N/A (This test is for only
Memory products.)
AEC-Q100 RELIABILITY REPORT
P/N : NR1640DC-Q Series
Automotive Grade = 1 : -40℃ to +125℃
MSL = LEVEL 1
TEST GROUP A – ACCELERATED ENVIRONMENT STRESS TESTS
Remark
TEST METHOD
ADDITIONAL REQUIREMENTS
JEDEC
JESD22-A104
-65ºC to +150ºC for 500 cycles
JEDEC
JESD22-A105
Ta of -40ºC to +125ºC for 1000 cycles
JEDEC
JESD22-A103
+150ºC for 1000 hours
JEDEC
J-STD-020
JESD22-A113
Soak for 168hours, 85℃/85%RH;
3X Reflow
JEDEC
JESD22-A101 or A110
HAST(110℃/85%RH for 264 hours)
JEDEC
JESD22-A102 or
A118 orA101
UHAST(110℃/85%RH for 264 hours)
AEC Q100-008
+125ºC for 48 hours
AEC Q100-005
TEST before and after EDR at room and hot
temperature. Sample size and lot requirement
applies to EACH of the NVM tests per Q100-
005.
TEST GROUP B – ACCELERATED LIFETIME SIMULATION TESTS
Remark
TEST METHOD
ADDITIONAL REQUIREMENTS
JEDEC
JESD22-A108
+125ºC for 1000 hours
Nisshinbo Micro Devices Inc.
STRESS ABV REF.NO. TEST BEFORE AND AFTER STRESS
SAMPLE
SIZE / LOT
NUMBER
OF LOTS
ACCEPT
CRITERIA
JUDGMENT
Wire Bond Shear WBS C1 - CPK >1.67 PASS
This test was performed
when this product was
developed.
Wire Bond Pull WBP C2 -
CPK >1.67
or 0 Fails
after TC
(test #A4)
PASS
This test was performed
when this product was
developed.
Solderability SD C3 - 15 1
>95% lead
coverage
PASS
This test was performed
when this product was
developed.
Physical Dimensions PD C4 - 10 3 CPK >1.33 PASS
This test was performed
when this product was
developed.
Solder Ball Shear SBS C5 -
5 balls from a
min. of 10
devices
3 - -
N/A (Solder Ball is not used
in this product.)
Lead Integrity LI C6 -
10 leads
from each of
5 parts
1 - -
N/A (The product is not for
through-hole devices.)
STRESS ABV REF.NO. TEST BEFORE AND AFTER STRESS
SAMPLE
SIZE / LOT
NUMBER
OF LOTS
ACCEPT
CRITERIA
JUDGMENT
Electromigration EM D1 - - - - -
Time Dependent
Dielectric Breakdown
TDDB D2 - - - - -
Hot Carrier Injection HCI D3 - - - - -
Negative Bias Temperature
Instability
NBTI D4 - - - - -
Stress Migration SM D5 - - - - -
TEST GROUP C – PACKAGE ASSEMBLY INTEGRITY TESTS
Remark
TEST METHOD
ADDITIONAL REQUIREMENTS
JEDEC
JESD22-B100 and B108
AEC Q003
See applicable JEDEC standard outline
and individual device spec for significant
dimensions and tolerances.
AEC Q100-010
AEC Q003
PC thermally (two 220ºC reflow cycles)before
integrity (mechanical) testing.Refer to J-STD-
020 for Pb-free reflow profiles to be used for
this test.
JEDEC
JESD22-B105
Not required for surface mount devices.
Only required for through-hole devices.
AEC Q100-001
AEC Q003
At appropriate time interval for each bonder
to be used.
30 bonds from a minimum
of 5 devices
MIL-STD883
Method 2011
AEC Q003
Condition C or D. For Au wire diameter
³1mil, minimum pull strength after TC = 3
grams. For Au wire diameter <1mil, refer
to Figure 2011-1 in MIL-STD-883 Method
2011 as a guideline for minimum pull
strength. For Au wire diameter <1mil, wire
bond pull shall be performed with the hook
over the ball bond and not at mid-wire.
JEDEC
JESD22-B102
or
JEDEC
J-STD-002
If burn-in screening is normally performed
on the device before shipment, samples for
SD must first undergo burn-in. Perform 8
hour steam aging prior to testing (1 hour for
Au-plated leads).The customer can request
justification for using dry bake in place of
steam aging.
TEST GROUP D – DIE FABRICATION RELIABILITY TESTS
Remark
TEST METHOD
ADDITIONAL REQUIREMENTS
-
The data, test method, calculations and
internal criteria should be available to the
user upon request for new technologies.
These tests are performed
whenever a new technology
is applied.
-
The data, test method, calculations and
internal criteria should be available to the
user upon request for new technologies.
-
The data, test method, calculations and
internal criteria should be available to the
user upon request for new technologies.
-
The data, test method, calculations and
internal criteria should be available to the
user upon request for new technologies.
-
The data, test method, calculations and
internal criteria should be available to the
user upon request for new technologies.
Nisshinbo Micro Devices Inc.