STRESS ABV REF.NO. TEST BEFORE AND AFTER STRESS
Wire Bond Shear WBS C1 - CPK >1.33 PASS
This test was performed
when this product was
developed.
CPK >1.33
or 0 Fails
after TC
(test #A4)
This test was performed
when this product was
developed.
Solderability SD C3 - 15 1
This test was performed
when this product was
developed.
Physical Dimensions PD C4 - 10 3 CPK >1.33 PASS
This test was performed
when this product was
developed.
Solder Ball Shear SBS C5 -
5 balls from a
min. of 10
devices
N/A (Solder Ball is not used
in this product.)
10 leads
from each of
5 parts
N/A (The product is not for
through-hole devices.)
STRESS ABV REF.NO. TEST BEFORE AND AFTER STRESS
Electromigration EM D1 - - - - -
Time Dependent
Dielectric Breakdown
Hot Carrier Injection HCI D3 - - - - -
Negative Bias Temperature
Instability
Stress Migration SM D5 - - - - -
TEST GROUP C – PACKAGE ASSEMBLY INTEGRITY TESTS
JEDEC
JESD22-B100 and B108
AEC Q003
See applicable JEDEC standard outline
and individual device spec for significant
dimensions and tolerances.
PC thermally (two 220ºC reflow cycles)before
integrity (mechanical) testing.Refer to J-STD-
020 for Pb-free reflow profiles to be used for
this test.
Not required for surface mount devices.
Only required for through-hole devices.
At appropriate time interval for each bonder
to be used.
30 bonds from a minimum
of 5 devices
MIL-STD883
Method 2011
AEC Q003
Condition C or D. For Au wire diameter
³1mil, minimum pull strength after TC = 3
grams. For Au wire diameter <1mil, refer
to Figure 2011-1 in MIL-STD-883 Method
2011 as a guideline for minimum pull
strength. For Au wire diameter <1mil, wire
bond pull shall be performed with the hook
over the ball bond and not at mid-wire.
JEDEC
JESD22-B102
or
JEDEC
J-STD-002
If burn-in screening is normally performed
on the device before shipment, samples for
SD must first undergo burn-in. Perform 8
hour steam aging prior to testing (1 hour for
Au-plated leads).The customer can request
justification for using dry bake in place of
steam aging.
TEST GROUP D – DIE FABRICATION RELIABILITY TESTS
The data, test method, calculations and
internal criteria should be available to the
user upon request for new technologies.
These tests are performed
whenever a new technology
is applied.
The data, test method, calculations and
internal criteria should be available to the
user upon request for new technologies.
The data, test method, calculations and
internal criteria should be available to the
user upon request for new technologies.
The data, test method, calculations and
internal criteria should be available to the
user upon request for new technologies.
The data, test method, calculations and
internal criteria should be available to the
user upon request for new technologies.
Nisshinbo Micro Devices Inc.