2023.3
32-BIT MCU FAMILY
RENESAS RA4E2 GROUP
Block Diagram
Key Features
100MHz Arm Cortex-M33 with TrustZone
128KB Flash memory and 40KB SRAM
4KB Data Flash to store data as in EEPROM
1KB Standby SRAM
Scalable from 32-pin to 64-pin packages
Target Applications
General purpose
Sensor applications (Healthcare, Industrial,
Wearable)
Home appliances
Entertainment systems
Gaming, Headset control
Entry-Line 100MHz Arm® Cortex®-M33 General Purpose
Microcontroller
The RA4E2 group is the newest entry-line microcontroller in the RA4 series
based on the 100 MHz Arm® Cortex®-M33 core with TrustZone.
RA4E2 MCUs offer high-performance and optimized peripheral functions
along with the smallest package options including space saving 36-pin BGA
and 32-pin QFN packages. These satisfy the needs of both cost-sensitive
and space-constrained applications.
The RA4E2 provides an entry point to the wider RA family due to its well-
balanced performance, advanced peripheral functions, and scalability.
USB 2.0 Full Speed
CAN FD, I3C
HDMI CEC, SSI
12-bit A/D Converter
12-bit D/A Converter
General PWM Timer
RA8
240MHz~
RA6
~240MHz
RA4
~100MHz
RA4E2
RA2
~60MHz
Mainstream
/
Low Power
Entry Line
Rich Analog
Wireless
Motor
Control
100 MHz Arm Cortex®-M33
Optimized features and footprint
CAN FD, I3C, and more
AnalogueMemory
Timers
Communication
System
Safety Security
Package
RA4E2
100MHz 32-Bit Arm
®
Cortex
®
-M33 Core NVIC | SWD | ETB
128-bit Unique ID
TRNG
12-bit ADC (12ch)
12-bit DAC (1ch)
Temperature Sensor
USB2.0 FS Device x 1 *
CAN FD x1
I3C x1
SCI x2
SPI x2
HDMI CEC x1
SSI x1
Memory Protection Unit
SRAM Parity Check
ECC SRAM
Clock Frequency
Accuracy Measurement
CRC Calculator
IWDT
Data Operation Circuit
Flash Area Protection
ADC Self Test
DMA (8ch), DTC, ELC
Clock Generation
On-Chip Oscillator
HOCO (16/18/20MHz)
MOCO (8MHz)
LOCO (32KHz)
ILOCO (15KHz)
Low-power Modes
Interrupt Controller
TrustZone
GPT16E (4ch)
Low-power GPT (2ch)
WDT
RTC, Calendar
* Excluding 32-pin package
Code Flash
(128KB)
SRAM 32KB Parity
SRAM 8KB ECC
Data Flash (4KB)
Standby SRAM (1KB)
LQFP 64
BGA 36, 64
QFN 32, 48
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renesas.com
Corporate Headquarters
TOYOSU FORESIA, 3-2-24 Toyosu, Koto-ku, Tokyo 135-0061, Japan
www.renesas.com
Trademarks
Arm® and Cortex® are registered trademarks of Arm Limited. Renesas and the Renesas
logo are trademarks of Renesas Electronics Corporation. All trademarks and registered
trademarks are the property of their respective owners.
Contact information
For further information on a product, technology, the most up-to-date version of a
document, or your nearest sales ofce, please visit:
www.renesas.com/contact/
© 2023 Renesas Electronics Corporation. All rights reserved.
RENESAS RA4E2 GROUP
For more details, please visit: renesas.com/ra4e2
Ordering References
Software Package
The Renesas Flexible Software Package (FSP) is designed to provide easy-to-use,
scalable, high-quality software for embedded system designs using the Renesas RA
family. The FSP is based on an open software ecosystem of production-ready drivers,
supporting Azure® RTOS, FreeRTOS™ or bare-metal programming. It also includes
a selection of other middleware stacks, providing great exibility for migrating code
from older systems or developing new applications from scratch.
Tools and Support
The e² studio IDE provides support with intuitive congurators and intelligent code
generation to make programming and debugging easier and faster.
Evaluation Kit
Effortlessly evaluate key features of RA4E2 MCU group and develop
sophisticated IoT and embedded systems applications
On-board debugging using SEGGER-J-Link®
Order the kit and download documentation, design
package,development tools and software at:
renesas.com/ek-ra4e2
Orderable part number: RTK7EKA4E2S00001BE
IDE Renesas e
2
studio Keil MDK IAR EWARM
Compiler
GCC
Arm Compiler
IAR Arm Compiler
Arm Compiler
IAR Arm
Compiler
Debug Probe
Renesas E2/E2 Lite
SEGGER J-Link
SEGGER J-Link
Keil ULINK
IAR I-Jet
SEGGER J-Link
Production
Programmer
Renesas PG-FP6 • SEGGER J-Flash • Partner solutions
Document No.: R01PM0087EU0100
Flash 128KB
R7FA4E2B93CNH R7FA4E2B92CBC R7FA4E2B93CNE R7FA4E2B93CFM R7FA4E2B92CBBRAM 40KB
DataFlash 4KB
Pin Count 32pin 36pin 48pin 64pin 64pin
Package QFN BGA QFN LQFP BGA
Size (body) 5x5mm 4x4mm 7x7mm 10x10mm 5x5mm
Pitch 0.5mm 0.5mm 0.5mm 0.5mm 0.5mm
Operating Temperature -40 to +105°C -40 to +85°C -40 to +105°C -40 to +105°C -40 to +85°C
Azure RTOS
FreeRTOS
Connectivity
USB
Security
File System
Graphics
Trace
Azure RTOS ThreadX
FreeRTOS
Hardware Abstraction Layer
(HAL)
Drivers
Board Support Package (BSP)
ARM TrustZone
Storage
Capacitive
Touch
Security
Controls &
Sensors
Connectivity
USB
Security
File System
Graphics
Evaluation Kit: RTK7EKA4E2S00001BE