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RENESAS RA4E2 GROUP
For more details, please visit: renesas.com/ra4e2
Ordering References
Software Package
The Renesas Flexible Software Package (FSP) is designed to provide easy-to-use,
scalable, high-quality software for embedded system designs using the Renesas RA
family. The FSP is based on an open software ecosystem of production-ready drivers,
supporting Azure® RTOS, FreeRTOS™ or bare-metal programming. It also includes
a selection of other middleware stacks, providing great exibility for migrating code
from older systems or developing new applications from scratch.
Tools and Support
The e² studio IDE provides support with intuitive congurators and intelligent code
generation to make programming and debugging easier and faster.
Evaluation Kit
■
Effortlessly evaluate key features of RA4E2 MCU group and develop
sophisticated IoT and embedded systems applications
■
On-board debugging using SEGGER-J-Link®
■
Order the kit and download documentation, design
package,development tools and software at:
renesas.com/ek-ra4e2
■
Orderable part number: RTK7EKA4E2S00001BE
IDE Renesas e
2
studio Keil MDK IAR EWARM
Compiler
•
GCC
•
Arm Compiler
•
IAR Arm Compiler
•
Arm Compiler
•
IAR Arm
Compiler
Debug Probe
•
Renesas E2/E2 Lite
•
SEGGER J-Link
•
SEGGER J-Link
•
Keil ULINK
•
IAR I-Jet
•
SEGGER J-Link
Production
Programmer
•
Renesas PG-FP6 • SEGGER J-Flash • Partner solutions
Document No.: R01PM0087EU0100
Flash 128KB
R7FA4E2B93CNH R7FA4E2B92CBC R7FA4E2B93CNE R7FA4E2B93CFM R7FA4E2B92CBBRAM 40KB
DataFlash 4KB
Pin Count 32pin 36pin 48pin 64pin 64pin
Package QFN BGA QFN LQFP BGA
Size (body) 5x5mm 4x4mm 7x7mm 10x10mm 5x5mm
Pitch 0.5mm 0.5mm 0.5mm 0.5mm 0.5mm
Operating Temperature -40 to +105°C -40 to +85°C -40 to +105°C -40 to +105°C -40 to +85°C
Hardware Abstraction Layer
Board Support Package (BSP)
Evaluation Kit: RTK7EKA4E2S00001BE