CH704 Datasheet
Rev 1.5
Page 1/16
CH704
AEC-Q100 Qualified, 200A Hall Current Sensor IC with 4800V
RMS
Reinforced Isolation
Features
• Reinforced isolation: 4800V
RMS
• AEC-Q100 qualified
• Single supply: 4.5-5.5V
• Output voltage proportional to DC/AC current:
+/-50A, +/-100A, +/-150A, +/-200A
• Bandwidth: 180 kHz
• Response time: < 2µs
• Wide temperature range: -40
o
C to 150
o
C
• High resolution offset and sensitivity trimming with EEPROM
• Primary conductor resistance: 0.1 mΩ
• Integrated protections
o Under-voltage protection
o Output voltage clamp provides short circuit diagnostic
o Output spiking suppress during fast current step inputs
• Factory programmed sensitivity and quiescent output voltage TC
• Integrated digital temperature compensation circuitry
• Nearly zero magnetic hysteresis
• Ratio-metric output from supply voltage
• Immunity to external magnetic field
Application
• UPS current sensing
• DC-to-DC converter control
• Balance bike motor control
• Overcurrent fault detection
Functional Block Diagram
Low Pass
Filter
Amp
`
EEPROM
And control logic
Sensitivity Polarity
Offset Trim and
Offset TC Trim
VCC
GND
VOUT
Sensitivity and
Sensitivity TC Trim
IP-
IP+
Signal Remodulation
Driver
Dynamic Offset
Cancellation
CH704 Datasheet
Rev 1.5
Page 2/16
Description
The device consists of a precise, low-offset, linear Hall sensor circuit with a copper conduction path
located near the surface of the die. Applied current flowing through this copper conduction path
generates a magnetic field which is sensed by the integrated Hall IC and converted into a proportional
voltage. A precise, proportional voltage is provided by the low-offset, chopper-stabilized Hall IC, which
is programmed for accuracy after packaging. The output of the device has a positive slope when an
increasing current flow through the primary copper conduction path, which is the path used for current
sensing.
The terminals of the conductive path are electrically isolated from the sensor leads. This allows the
CH704 current sensor IC to be used in high-side current sense applications without the use of high-
side differential amplifiers or other costly isolation techniques.
The lead-frame is plated with 100% matte tin, which is compatible with standard lead (Pb) free printed
circuit board assembly processes. Internally, the device is Pb-free, except for flip-chip high-
temperature Pb-based solder balls, currently exempt from RoHS. The device is fully calibrated prior to
shipment from the factory.