DFN1006-2L
12
Circuit Diagram
Discription
components from damage or upset due to electrostatic
discharge (ESD) and other voltage induced transient events.
Excellent clamping capability, low leakage, low capacitance,
protection on designs that are exposed to ESD.
It gives designer the flexibility to protect one bi-directional
line in applications where arrays are not practical.
The ESD8L5.0C protects sensitive semiconductor
and fast response time provide best in class
ESD PROTECTION DIODE
ELECTRONICS CO.,LTD
HUAXUANYANG HXY
ESD8L5.0C
Ordering information
ESD8L5.0C
10000
Ultra Low Capacitance 0.6 pF
Low Clamping Voltage
Small Body Outline Dimensions:
0.039″ x 0.024″ (1.00 mm x 0.60 mm)
Low Body Height: 0.020″ (0.5 mm)
Stand−off Voltage: 5 V
Low Leakage
Response Time is Typically < 1.0 ns
IEC61000−4−2 Level 4 ESD Protection
This is a Pb−Free Device
Specification Features:
www.hxymos.com
Shenzhen HuaXuanYang Electronics CO.,LTD
Absolute Ratings (T
amb
=25
°C )
Symbol
Parameter
Value
Units
P
PP
Peak Pulse Power (t
p
= 8/20μs) 45
T
L
Maximum lead temperature for soldering during 10s 260 °C
T
stg
Storage Temperature Range -55 to +150 °C
T
op
Operating Temperature Range -40 to +125 °C
T
j
Maximum junction temperature 150 °C
IEC61000-4-2 (ESD) air discharge
contact discharge
±10
±15
KV
W
1
2