Customer Value
Proposition
Parker Chomerics THERM‐A‐GAP PAD 70TP
is a high performance, highly conformable
thermally conductive gap filler pad with 7.0
W/m‐K thermal conductivity. It provides superior
thermal performance and long‐term stability
over conventional thermal pads with very low
compression force.
THERM‐A‐GAP PAD 70TP is designed to provide
effective heat transfer between electronic
components and their associated cooling features
such as heat sinks. The physical properties of this
gap pad allow it to exhibit very high conformability
and minimize the compressive load on underlying
electronics. “TP” in the product name stands for
“Thermal Putty” indicating that, unlike other gap
pads, this material is meant for static, one‐time
assembly because it will permanently conform to
displace air gaps caused by uneven surfaces or rough
surface textures.
THERM‐A‐GAP PAD 70TP is offered as a standalone
material, or with one of several carrier options; a
woven glass carrier; either offset to one surface
for a clean break feature (G carrier) or located
approximately in the center of the part thickness (F
carrier), both offering improved tear resistance and
easier handling. There is also an aluminum foil carrier
(A carrier) option with a pressure sensitive acrylic
adhesive (PSA) on one side.
Product Features
High thermal conductivity
7.0 W/m-K
Highly conformable, soft
Low deflection force
Electrically isolating
Low oil bleeding
One-time assembly
Contact Information
Parker Hannifin Corporation
Chomerics Division
77 Dragon Court
Woburn, MA 01801
phone 781 935 4850
fax 781 933 4318
chomailbox@parker.com
parker.com/chomerics
Typical Applications
Telecom Equipment
PC board to chassis
Thermally enhanced BGAs
Memory packages & modules
GPU & CPU
Industrial Devices
THERM-A-GAP
PAD 70TP
7.0 W/m-K Thermally Conductive Very Low
Compression Force Thermal Putty Sheet Material
THERM-A-GAP
PAD 70TP Product Information
† Typical properties: these are not to be construed as specifications.
* Thickness tolerance, inches(mm) is ±10% of the nominal part thickness for parts 0.100” (2.5mm) thick or less; those parts greater than 0.100” (2.5mm) thick are held to ±0.010”
(2.5mm).
** The typical deflection range of Therm-A-Gap 70TP is approximately 15% to 40% (or more depending on the carrier option and pad thickness. Evaluation of the part in your specific
application is recommended.) Samples are available upon request.
Typical Properties
PAD 70TP Test Method
Physical
Color Dark Grey Visual
Carrier Options:
G = Woven glass carrier - offset to one side. No pressure sensitive adhesive (PSA) option
A = Aluminum foil carrier with pressure sensitive adhesive (PSA)
F = Woven glass carrier - centered on thickness. No pressure sensitive adhesive (PSA) option
No letter suffix = None (unsupported), No pressure sensitive adhesive (PSA)
PAD70TPG
PAD70TPA
PAD70TPF
PAD70TP
--
Standard Thicknesses*, in. (mm)
(See part number table for thickness limits by type of carrier.)
0.030 - 0.200
(0.76 - 5.08)
ASTM D374
Specific Gravity 3.3 ASTM D792
Hardness, Shore 00 15 ASTM D2240
Percent Deflection @ Various Pressures**
(0.120 in thick unsupported sample)
@ 5 psi (34 kPa)
@ 10 psi (69 kPa)
@ 25 psi (172 kPa)
@ 50 psi (345 kPa)
% Deflected
18%
42%
63% **
73% **
ASTM C165 MOD
(1.0 in
2
disc probe,
0.025 in/min rate)
Thermal
Operating Temperature Range, °F (°C)
-67 to 392
(-55 to 200)
Chomerics
Thermal Conductivity, W/m-K 7.0 ASTM D5470
Thermal Impedance, °C-in
2
/ W (°C-cm
2
/W) @ 10 psi, 0.04 in. (1mm) thick G carrier
0.27 (1.7) ASTM D5470
Heat Capacity, J/g-K 0.72 ASTM E1269
Coefficient of Thermal Expansion, ppm/K 150 ASTM E831
Electrical
Dielectric Strength, V
AC
/mil (kV
AC
/mm) 200 (8) ASTM D149
Volume Resistivity, ohm-cm 10
13
ASTM D257
Dielectric Constant @ 1,000 kHz and at 0.11” (2.8mm) thick 5.6 ASTM D150
Dissipation Factor @ 1,000 kHz and at 0.11” (2.8mm) thick 0.001 CHO-TM-TP13
Regulatory
Flammability Rating
(See UL File E140244 for Details)
V-0 UL 94
RoHS Compliant Yes Chomerics Certification
Outgassing, % TML (% CVCM) 0.10 (0.03) ASTM E595
Shelf Life, months from date of shipment (PAD70TPA) 24 (18) Chomerics
Storage Conditions, °F (°C) @ 50% Relative Humidity
50 to 90
(10 to 32)
Chomerics