Wireless Power Receiver
for ≤ 3W Applications
P9027LP-R
Datasheet
© 2016 Integrated Device Technology, Inc
1
April 28, 2016
Description
The P9027LP-R is a highly integrated, low Bill-of-Materials (BOM)
count, single-chip receiver targeted for 0.5 to 3 W applications.
Using the magnetic inductive charging technology, it converts an
AC power signal from a resonant tank into a regulated
programmable DC output voltage ranging from 4.5 to 6.0 Volts.
The receiver has a patented internal scheme for communication
and modulation using zero external components. As a result, it
provides an extremely small application area. Together with the
P9235A-R transmitter, the P9027LP-R is a complete wireless
power system solution.
The P9027LP-R is available in a WLCSP-40 package (2.24 mm ×
3.62 mm, 0.4 mm pitch), and it is rated for 0 to 85°C ambient
operating temperature range.
Typical Applications
Smart Watches
Headsets
Digital Cameras
Portable Medical Applications
Figure 1. Typical Applications Circuit
Features
Small solution area: ~32mm
2
Patented over-voltage protection clamp eliminating external
capacitors
Optimized for 0.5 to 3 W applications
Integrated low dropout tracking LDO
Low synchronous rectifier R
DS(ON)
for high efficiency
Programmable rectifier voltage for optimal transient response
versus efficiency
Integrated charge pump for startup under weak coupling or
poor alignment
Programmable output voltage: 4.5 to 6.0 V
Programmable current limit
Open-drain interrupt flag
Power transfer LED indicator
Dedicated remote temperature sensing
Active low enable pin for electrical on/off
I
2
C interface
0 to +85°C ambient operating temperature range
WLCSP 2.24 mm X 3.62 mm, 40 pin package
P9027LP-R
L
X1
V
RECT
C
RECT
R
1
AGND
SCL
SDA
SCL
SDA
C
d
OUT
C
OUT
V
OUT
=5V
Chip Enable
C
FLY
C
FLY1
PGND
V
HDR
V
SET
End of Charge
L
RX
Interupt
EOC
OUTSNS
C
FLY2
L
X2
V
DD
C
VDD
TS1
TS2
R
TS1
R
TS2
INT
EN
R
HDR
IOC
R
IOC
ACT
P9027LP-R Datasheet
© 2016 Integrated Device Technology, Inc
2
April 28, 2016
Absolute Maximum Ratings
Stresses greater than those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only
and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is
not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
Table 1. Thermal Information
1,2
Pins
Units
RECT, OUT, OUTSNS
V
LX1, LX2
V
PGND, AGND
V
VDD, CFLY1, CFLY2, SDA, SCL, EN
, ACT
, IOC, VSET, VHDR, INT
, EOC, TS1, TS2,
V
Maximum input current into SFBR
A
All voltages here are measured with respect to analog ground pin (AGND).
Table 2. Thermal Symbol Information
1,2
Symbol
Description
Rating
Units
JA
Thermal Resistance (WLCSP-40)
71
C/W
JC
Thermal Resistance Junction to Case
18
C/W
T
A
Ambient Operating Temperature Range
0 to 85
C
T
J
Junction Operating Temperature Range
0 to 125
C
T
Js
Junction Storage Temperature Range
-55 to 150
C
T
LEAD
Maximum Soldering Temperature (at Leads)
300
C
Notes:
1. The maximum power dissipation is P
D(MAX)
= (T
J(MAX
)-T
A
)/θ
JA
where T
J(MAX)
is 125°C. Exceeding the maximum allowable power
dissipation will result in excessive die temperature, and the device will enter thermal shutdown.
2. The thermal rating was calculated based on a JEDEC 51 standard 4-layer board, 6 vias with dimensions 4 in × 4.5 in still air
conditions. Actual thermal resistance will be affected by PCB size, solder joint quality, PCB layer count, copper thickness, air flow,
altitude, and other unlisted variables.
Table 3. ESD Information
Test Model
Pins
Rating
Units
HBM
All
2,000
V
CDM
All
500
V