ATP DDR3 Configurations
A typical monolithic DDR3 DRAM chip has a density of 4 Gigabits (Gb). To pack 8 Gb in a monolithic DRAM die, manufacturers
employ a die-stacking method called dual-die package (DDP), which combines two bare memory dies within a single chip package.
Each die has a separate set of control lines where each memory die is separately selectable, and the processor treats the chip as
two components despite being in the same package.
ATP DDR3 components are available in monolithic 8 Gb one-chip select (1CS) or as DDP two-chip select (2CS) for a variety of
memory modules based on this technology.
With ATP’s own-built DDR3 modules, the company reaffirms its commitment to continue supporting legacy memory requirements
to maximize customers’ infrastructure investments.
16
UDIMM No 2G x 64 2 1G x 8 16 Mono 1600
DDR3 UDIMM
Capacity (GB) Form Factor ECC Org Ranks Component Org Component Qty. Technology
Speed up to
(MT/s)
16
UDIMM ECC Yes 2G x 72 2 1G x 8 18 Mono 1600
16
ULP UDIMM ECC Yes 2G x 72 2 1G x 8 18 Mono 1600
DDR3 RDIMM
Capacity (GB) Form Factor ECC Org Ranks Component Org Component Qty. Technology
Speed up to
(MT/s)
32
RDIMM Yes 4G x 72 4 1G x 4 x 2R 36 / 72 Die DDP 1333
16
VLP RDIMM Yes 2G x 72 2 1G x 4 x 2R 18 / 36 Die DDP 1600
DDR3 SO-DIMM
Capacity (GB) Form Factor ECC Org Ranks Component Org Component Qty. Technology
Speed up to
(MT/s)
16
SO-DIMM ECC Yes 2G x 72 2 1G x 8 18 Mono 1600
16
SO-DIMM No 2G x 64 2 1G x 8 16 Mono 1600
v1.1 032023
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