Preliminary 860-930 MHz RF Front-End Module
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Data Sheet
GC1109
Features
⚫ Integrated PA with +30 dBm output
power
⚫ Integrated LNA with noise figure of
2dB, typical
⚫ Alternate TX input pin simplifies
connection to any SoC
⚫ Transmit bypass path with low loss:
< 1.0 dB
⚫ Single-ended 50 Ω input and output
ports
⚫ Fast turn-on/turn-off time: < 2 μs Rx
mode and < 4 μs Tx mode
⚫ Supply voltage on VCC up to 4V
⚫ Sleep mode current: < 1 μA
⚫ MCM (16-pin, 3.0 x 3.0 x 0.75 mm)
NiPdAu plated package
Applications
⚫ LP-WAN devices
⚫ Internet of Things
⚫ Smart meters
⚫ Industrial applications
⚫ Range extender
Product Highlights
⚫ High output power
⚫ Integrated PA output match
Description
The GEO chip GC1109 is a high-performance,
highly integrated RF front-end module designed for
high-power Industrial, Scientific, Medical (ISM)
band applications operating in the 860 to 930 MHz
frequency range.
The GC1109 is designed for ease of use and
maximum flexibility with fully matched 50 Ω TX and
RX inputs and antenna outputs, and digital controls
compatible with 1.2 to 3.6 V CMOS levels.
The GC1109 is packaged in a 16-pin, 3.0 x 3.0 x
0.75 mm Multi-Chip Module (MCM) package.
Geo-chip Green™ products are
compliant with all applicable
legislation and are halogen-free.
TX
RX
TX_ALT
PA
_OUT
LNA
_IN
RX
_FLT
TX
_IN
ANT
PA
LNA
Logic Control
CPS
CTX
CSD
Output
Match
Figure 1. GC1109 Block Diagram
Data Sheet
Preliminary
GC1109
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Table1.Pin Description
Name
Pin
Description
TX
1
Transmit mode RF input
RX
2
Receive mode RF output
TX_ALT
3
Transmit mode RF input (alternate pin)
CSD
4
Shut down control input
CPS
5
Bypass mode select input
CTX
6
Transmit mode select input
LNA_IN
7
LNA input (from RX filter)
RX_FLT
8
RX signal from antenna (to RX filter)
ANT
9
Connect to 50 Ω antenna
GND
10
Connect to PCB ground
TX_IN
11
TX input signal to antenna (from OMN)
GND
12
Connect to PCB ground
PA_OUT
13
PA output and positive power supply
N/C
14
Not connected internally to the device
VBAT
15
Positive power supply
VCC
16
Positive power supply
Paddle
17
Expose die paddle; electrical and thermal
ground. Connect to PCB ground
Table 2. Absolute Maximum Ratings
Parameters
Symbol
Minimum
Maximum
Unit
Tx input power at TX port
PIN_TX_MAX
+10
dBm
TX input power at TX port (bypass
mode)
PIN_TX_BYP_MAX
+20
dBm
Rx input power at ANT port
PIN_RX_MAX
+10
dBm
Supply voltage on VBAT (no RF)
VBAT
2.8
4.6
Volts
Supply voltage on VCC (no RF)
VCC
-0.3
4.2
Volts
Operating Temperature
Tcase
-40
85
℃
Storage Temperature
Tstg
-40
125
℃
ESD (HBM)
+3000
Volts
ESD (CDM)
+500
Volts
Note: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with
only one parameter set at the limit and all other parameters set at or below their nominal value. Exceeding any of the limits listed here
may result in permanent damage to the device.
Table 3. Recommended Operating Condition
Parameters
Symbol
Minimum
Nominal
Maximum
Unit
Operating Frequency
F
860
930
MHz
Supply Voltage on VBAT
VBAT
2.8
3.3
4.2
Volts
Supply Voltage on VCC
VCC
0.5
3.3
4
Volts
Mode Control Voltage High
VMODE_High
1.2
3.6
Volts
Mode Control Voltage Low
VMODE_Low
0
0.3
Volts
Operating Temperature
Tcase
-40
+25
+85
℃
Note: 1. CSD/CPS/CTX voltage level must not exceed VBAT voltage.
2. VBAT must be prior to CSD/CPS/CTX for the power on sequence.
TX
RX
TX_ALT
CSD
VCC VBAT
N/C PA_OUT
CPS CTX
LNA_IN RX_FLT
GND
TX_IN
GND
ANT
1
2
3
4
5 6 7 8
9
10
11
12
13141516
GND
Figure 2.GC1109 Pinout (Top view)