Sunlord
http://www.sunlordinc.com
Ultra-low profile and Ultra-large current Co-fired power inductor
HTF series New Product Launch
Outline
Ultra-low profile and Ultra-large current Co-fired power inductor HTF series products adopt innovative copper
magnetic Co-fired technology, which can achieve higher characteristics in the same size or achieve equivalent
performance in smaller sizes compared to similar products. It has ultra-low loss, ultra-large current, and has the
ability to be much thinner in the overall dimension design. Its unique copper magnetic co-firing process ensures
excellent heat dissipation characteristics and high reliability. Due to the advanced production process, it has the
advantages of both molded and assembled power inductors, it can be used to produce small size but large current
inductors and large size meanwhile large current ultra-thin inductors. Regarding the application, it can support
single coil DCDC power supply and coupling inductor for multi-phase power supply applications.
It is especially suitable for some ultra-thin high-power applications, as well as scenarios with high
requirements for heat dissipation and reliability. Its unique advantages are incomparable to those of molded
inductors and assembled inductors.
Application:
➢ The CPU power supply in high-end PC, Pad and other applications uses ultra-thin features to improve
the equipment cooling system.
➢ The CPU, GPU and related circuits in servers, AI servers and other high current and ultra-thin
applications for the power supply. The ultra-thin high current can deal with the VRM and TLVR power
supply scheme, and reduce the board area through back PCB mounting.
Background
Small size, big trust.
With the trending of low profile for AI servers, high-end PCs, Pads, mobile phones and other products, as well
as the inherent requirements of high power. It has a huge impact on the size and power consumption of internal
components. Meanwhile, the DCDC circuit, as the power supply, subjected to the market request, needs to
achieve ultra-low profile while maintaining high power. Which, of course, depending on direct current flow capacity
of the power inductor. The ultra-thin ultra-large current copper magnetic Co-fired power inductor came out at the
historic moment.
At the same time, accompany with high reliability, high heat dissipation capacity and low loss are also deemed
to become the highlights of copper magnetic Co-fired inductor.
Product Features
◼ Have incomparable ultra-thin advantages
◼ Ultra high reliability
◼ Wide operating temperature range, no long-term high temperature aging problem
◼ High saturation current characteristic
◼ Ultra low RDC, lower loss and higher power conversion efficiency
◼ Wide operating frequency range
◼ HTF series inductors use Sunlord's unique copper magnetic co-firing technology and have several patents
Sunlord
http://www.sunlordinc.com
Patent No
Patent name
Explain
CN 105940466 B
Metal matrix composite conductor, power inductor and its preparation method
Chinese Patent Granted
US 20180130600 A1
Metal matrix composite wire, power inductor, and preparation method therefor
US Patent Granted
CN 105934803 B
Composite conductor and its preparation method and a preparation method of power inductor
Chinese Patent Granted
US 20180137950 A1
Composite wire and preparation method therefor, and preparation method for power inductor
US Patent Granted
CN107749340A
A High Reliability and High Current Molded Inductor and Its Manufacturing Method
Chinese Patent Granted
WO2021197513A2
Integrally formed inductor and manufacturing method therefor
Within the specified period of PCT
CN113661549A
One piece forming inductor and its manufacturing method
Substantive Examination of
Chinese Patent
Application
◼ VRM and TLVR power supply of server CPU, GPU, FPGA, etc
◼ Power supply for ultra-thin Notebook and Pad
External Dimensions
HTF series specifications: (customizable)
Parameters
A
B
C
E
a
b
c
Unit
mm
mm
mm
mm
mm
mm
mm
HTF100424HR10LT
10.0±0.2
4.0±0.2
2.4 Max
1.5±0.3
3.9 Typ.
6.6 Typ.
10.4 Typ.
HTF130517HR14LT
12.8±0.2
4.8 Max
1.7 Max
1.5±0.3
2.6 Typ.
9.4 Typ.
13.2 Typ.
HTF120840HR22MT
12.8±0.4
8.2 Max
4.0 Max
2.5±0.5
5.0 Typ.
6.0 Typ.
14.5 Typ.
HTF070415H50NLT
7.0±0.2
4.5±0.2
1.3±0.2
1.5±0.3
2.9 Typ.
3.6 Typ.
7.4 Typ.
Product size: Recommended pad size: