QUALIFICATION REPORT
EPC Reliability & Quality
EPC – POWER CONVERSION TECHNOLOGY LEADER | EPC-CO.COM | ©2022 | | 1
EPC eGaN® FET
Automotive Qualication Report
EPC2088
EFFICIENT POWER CONVERSION
Dr. Shengke Zhang, VP of Reliability, Efficient Power Conversion
This report summarizes the Product Qualication results for EPC part
numbers EPC2088, EPC2204A, EPC2218, EPC2204A, EPC2218A and
EPC2302 meet all required qualication requirements and are released
for production.
Scope
The testing matrix in this qualication report covers the qualication of
EPC2088, a wafer level chip scale package 100 V eGaN power transistor.
For device level tests, EPC2088 is qualied by matrix with EPC2218 and
EPC2302 that have identical voltage ratings and share the same device
design and process. Similarly, for package related reliability tests,
EPC2088 is qualied by matrix with EPC2218A and EPC2204A, where
they utilize the same packaging technology platform.
Part
Number
Voltage
(V)
R
DS(on)
(mΩ)
Die Size
(mm x mm)
EPC2088 100 3.2 L (3.5 x 1.95)
EPC2218 100 3.2 L (3.5 x 1.95)
EPC2302 100 1.8 XL (5 x 3) - QFN
EPC2218A 80 3.2 L (3.5 x 1.95)
EPC2204A 80 6 S (2.5 x 1.5)
Qualication Test Overview
EPC’s eGaN FETs were subjected to a wide variety of stress tests under
conditions that are typical for silicon-based power MOSFETs. These tests
included:
- High temperature, reverse bias (HTRB): Parts are subjected to a drain-
source voltage at the maximum rated temperature
- High temperature, gate bias (HTGB): Parts are subjected to a gate-source
voltage at the maximum rated temperature
- High temperature storage (HTS): Parts are subjected to heat at the
maximum rated temperature
- Moisture sensitivity level 1 (MSL1): Parts are subjected to moisture,
temperature, and three cycles of reow. MSL1 is the most stringent of
the moisture sensitivity levels, requiring 85°C and 85% humidity for 168
hours.
- High temperature, high humidity, reverse bias (H3TRB): Parts are
subjected to humidity under high temperature with a drain-source
voltage applied
The stability of the devices is veried with DC electrical tests after stress
biasing. The electrical parameters are measured at time-zero and at
interim readout points at room temperature. Electrical parameters such
as the gate-source leakage, drain-source leakage, gate-source threshold
voltage, and on-state resistance are compared against the data sheet
specications. A failure is recorded when a part exceeds the datasheet
specications. eGaN FETs are stressed to meet the latest Joint Electron
Device Engineering Council (JEDEC) standards when possible.
Parts for all tests except for TC were mounted onto high Tg FR4 adaptor
cards. Adaptor cards of 1.6 mm in thickness with two copper layers were
used. The top copper layer was 1 oz. or 2 oz., and the bottom copper layer
was 1 oz.
QUALIFICATION REPORT
EPC Reliability & Quality
EPC – POWER CONVERSION TECHNOLOGY LEADER | EPC-CO.COM | ©2022 | | 2
High Temperature Gate Bias
For HTRB, EPC2088 is qualied by matrix with EPC2218 and EPC2302, where parts were subjected to 100% of the rated gate-source voltage at the
maximum rated temperature for a stress period of 1000 hours.
High Temperature Storage
Both HTRB and HTGB were conducted at 150oC, the maximum rated temperature of the product, and the same temperature used for High
Temperature Storage. Therefore, the units reported for HTRB and HTGB cover this HTS test.
High Temperature High Humidity Reverse Bias
Parts were subjected to a drain-source bias at 85% RH and 85°C for a stress period of at least 1000 hours. The testing was performed in accordance
with the JEDEC Standard JESD22A101.
Table 2. High Temperature Gate Bias Test
Table 3. High Temperature Storage Test
Table 4. High Temperature High Humidity Reverse Bias Test
Stress Test Part Number
Voltage
(V)
Die Size
(mm x mm)
Test Condition # of Failure
Sample Size
(sample x lot)
Duration
(Hours)
HTGB
EPC2218
6 L (3.5 x 1.95) T = 150°C, V
GS
= 6 V 0 77 x 2 1000
HTGB
EPC2302
6 XL (5 x 3) - QFN T = 150°C, V
GS
= 6 V 0 77 x 3 1000
Stress Test Part Number
Voltage
(V)
Die Size
(mm x mm)
Test Condition # of Failure
Sample Size
(sample x lot)
Duration
(Hours)
HTS
EPC2218
100 L (3.50 x 1.95) T = 150°C, Air 0 77 x 2 1000
HTS
EPC2302
100 XL (5 x 3) - QFN T = 150°C, Air 0 77 x 3 1000
Stress Test Part Number
Voltage
(V)
Die Size
(mm x mm)
Test Condition # of Failure
Sample Size
(unit x lot)
Duration
(Hours)
H3TRB
EPC2218A
80 L (3.5 x 1.95) T = 85°C, RH = 85%, V
DS
= 80 V 0 77 x 3 1000
H3TRB
EPC2204A
80 S (2.5 x 1.5) T = 85°C, RH = 85%, V
DS
= 80 V 0 77 x 1 1000
High Temperature Reverse Bias
For HTRB, EPC2088 is qualied by matrix with EPC2218 and EPC2302, where parts were subjected to 80% of the maximum rated drain-source voltage at the
maximum rated temperature for a stress period of 1000 hours.
Table 1. High Temperature Reverse Bias Test
Stress Test Part Number
Voltage
(V)
Die Size
(mm x mm)
Test Condition # of Failure
Sample Size
(sample x lot)
Duration
(Hours)
HTRB
EPC2218
100 L (3.5 x 1.95) T = 150°C, V
DS
= 80 V 0 77 x 2 1000
HTRB
EPC2302
100 XL (5 x 3) - QFN T = 150°C, V
DS
= 80 V 0 77 x 3 1000
Moisture Sensitivity Level
Parts were subjected to 85% RH at 85°C for a stress period of 168 hours (as dened by J-STD-020E for MSL1 products). The parts were then
subjected to three cycles of Pb-free reow in accordance with the IPC/JEDEC joint Standard J-STD-020.
Table 5. Temperature Cycling Test
Stress Test Part Number
Voltage
(V)
Die Size
(mm x mm)
Test Condition # of Failure
Sample Size
(sample x lot)
Duration
(Cycles)
MSL1
EPC2218A
80 L (3.5 x 1.95) T = 85°C, RH = 85%, 3x reow 0 77 x 2 400
MSL1
EPC2204A
80 S (2.5 x 1.5) T = 85°C, RH = 85%, 3x reow 0 77 x 1 400