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Datasheet - CPU/GPU
Liquid Cold Plates
CPU & GPU LIQUID COLD PLATES
Liquid Cooling enables high heat transfer from CPU and GPU
packages with low thermal resistance. By mounting liquid
cold plates to high performance chips, heat is removed
quickly and eciently from sensitive components when
installed in a complete liquid cooling system.
Boyd’s Liquid Cold Plates for CPUs & GPUs consist of
additional internal surface area for added heat transfer and
aluminum mounting frame which enables high mounting
forces while still maintaining structural integrity of the board.
Boyd’s cold plates come preassembled with Intel® Xeon® or
AMD SP3 compatible hardware and pre-applied with thermal
grease for fast installation.
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Part Number Mounting Conguration
668348 Intel® Xeon®
668359 AMD Rome SP3
ORDERING INFORMATION
Boyd reserves the right to make changes to products or information contained herein without noticed. For additional information, please contact Boyd
directly. *Intel and Xeon are trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other countries.
Contact your Boyd representative for more information for our Liquid Cold Plates including additional mounting methods or
arrangements.
Boyd oers a wide range of high performance cooling products for high-end computing systems from advanced air cooling
systems, integrated two phase enhancements, and complete liquid cooling systems.
• Maximum Performance utilizing increased surface area for liquid cold plate to uid heat transfer.
• High performance thermal grease pre-applied to base and shipped with individual protective grease shield.
• Pre-assembled with captive mounting hardware and ready for installation.
• High surface atness combined with specialized thermal grease ensure minimum thermal interface
resistance.
FEATURES AND BENEFITS
