Thermal Model
of EPC2308
• The thermal model applies to EPC2308.
• A power dissipation of 1 W in the device active area is assumed.
• Finite element analysis (FEA) thermal simulations
• R
ΘJB
and R
ΘJC
are obtained by stationary simulations.
• Z
ΘJB
and Z
ΘJC
are obtained by transient simulations.
• R-C thermal model is generated.
2
EPC2308 FEA thermal simulation
Power Conversion Technology Leader epc-co.com