[ASOP-C20-125]
Product Change Notice (PCN)
Subject:
Using new assembly site for R-Car V3M.
Publication Date:
1/26/2021
Effective Date:
12/15/2021
Revision Description:
Initial Release
Description of Change:
We will add the new production site(Assembly process：ASE<ASEKH>).
Item
New (Additional)
Current
Assembly
Company
・Advanced Semiconductor
Engineering Inc. (ASE<ASEKH>)
・Powertech Technology Inc. （PTI）
Renesas Electronics Corporation.
Oita Factory. (Oita)
Location
Taiwan (ASE<ASEKH> , PTI )
Japan
Machine
Standard equipment
Standard equipment
Method Refer to Page3-4. Refer to Page3-4.
Material
(BGA substrate)
BGA Vendor B
(ASE assembly)
BGA Vendor C (PTI assembly)
BGA Vendor A (Oita assembly)
(TIM)
TIM B (ASE / PTI assembly)
TIM A (Oita assembly)
(Lid)
Lid B (ASE assembly)
Lid C (PTI assembly)
Lid A (Oita assembly)
(Adhesive Resin) Adhesive B (ASE assembly) Adhesive A (Oita assembly)
Measurement
Equivalent
－
Environment
Equivalent
－
Affected Product List:
Device
Booking Part Number
R-Car
V3M
R8A77970LA01BA#G9(no change)
Reason for Change:
In order to increase production capacity according with the increased demand.
Impact on Fit, Form, Function, Quality & Reliability:
Form, fit: [none]
Characteristics: [none]
Function: [none]
Quality, reliability: [none]
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[ASOP-C20-125]
Product Identification:
Our production history data can also be queried by using the trace code of the product.
Qualification Status:
- 7/30/2021
Sample Availability Date:
5/15/2021
Device Material Declaration:
-7/30/2021
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