Material Declaration
Comliance Date:
RoHS Compliance: Yes
MSL: 3
Chip Wafer Circuit 8 6.98 69,796 Silicon (Si) 7440-21-3 8.000 6.980% 100.00%
Bonding Wire
Conductivity 0.65 0.57 5,671 Gold (Au) 7440-57-5 0.650 0.567% 100.00%
Die Attach Die Attach 0.43
0.38 3,752 Synthetic rubber (Trade secret) 0.009 0.008% 2.00%
Silicon, amorphous 7631-86-9 0.086 0.075% 20.00%
Phenol resin (Trade secret) 0.043 0.038% 10.00%
Epoxy resin (Trade secret) 0.043 0.038% 10.00%
Polypropylene copolymer
(Dicing tape)
(Trade secret) 0.180 0.157% 41.90%
Acrylic resin (Trade secret) 0.052 0.045% 12.00%
Polyethylene copolymer (Trade secret) 0.018 0.015% 4.10%
Substrate Substrate 40.46 35.299 352992
Barium Sulfate 7727-43-7 2.913 2.542% 7.20%
Dipropylene
glycolmonomethyl ether
34590-94-8 1.554 1.355% 3.84%
Talc containing
noasbestiform fibers
14807-96-6 0.259 0.226% 0.64%
Epoxy resin Trade seacret 1.424 1.243% 3.52%
Morpholine derivative Trade seacret 0.259 0.226% 0.64%
Naphthalene 91-20-3 0.065 0.056% 0.16%
Cured thermosettingresin
(includinginorganic filler)
Trade seacret 10.135 8.842% 25.05%
Continuous FilamentFiber
Glass
Trade seacret 6.672 5.821% 16.49%
Bisphenol A Epoxy Resin 80-05-7 0.085 0.074% 0.21%
Copper 7440-50-8 16.540 14.430% 40.88%
Gold 7440-57-5 0.065 0.056% 0.16%
Nickel 7440-02-0 0.490 0.427% 1.21%
Molding 56.38 49.19 491,886
Silica (Fused) 60676-86-0 50.460 44.024% 89.50%
Compound
Epoxy resin (Trade secret) 2.819 2.459% 5.00%
Phenol resin (Trade secret) 2.819 2.459% 5.00%
Carbon Black 1333-86-4 0.282 0.246% 0.50%
Solder Ball Solder 8.70 7.59 75,903 Tin (Sn) 7440-31-5 8.396 7.325% 96.50%
Silver (Ag) 7440-22-4 0.261 0.228% 3.00%
Copper (Cu) 7440-50-8 0.044 0.038% 0.50%
Model (Part) Number AS6CE4016B-45BIN
Package Weight (mg)
114.62
Material
wt% of
Sub part
Chip
Protection
Composed
parts
Material
Weight
(mg)
CAS No.Purpose
Weight
(mg)
% ppm
Material
wt% of
total
Jun./07/2022
Pin count /Package
48B BGA (6X8)