Material Declaration
Comliance Date:
RoHS Compliance: Yes
MSL: 3
Chip Wafer Circuit 13.79 3.16 31,606 Silicon (Si) 7440-21-3 13.790 3.161% 100.00%
Bonding Wire
Conductivity 0.86 0.20 1,971 Gold (Au) 7440-57-5 0.860 0.197% 100.00%
Die Attach Conductivity 1.09
0.25 2,498 Silver (metal powder) 7440-22-4 0.839 0.192% 77.00%
Acrylic resin (Trade secret) 0.093 0.021% 8.50%
Polybutadiene derivative (Trade secret) 0.060 0.014% 5.50%
Butadiene copolymer (Trade secret) 0.011 0.002% 1.00%
Epoxy resin (Trade secret) 0.027 0.006% 2.50%
Acrylate (Trade secret) 0.044 0.010% 4.00%
Peroxide (Trade secret) 0.005 0.001% 0.50%
Additive (Trade secret) 0.011 0.002% 1.00%
Lead Frame Base Metal 176.82 40.53 405,262
Copper ( Cu ) 7440-50-8 166.741 38.216% 94.30%
Nickel ( Ni ) 7440-02-0 5.658 1.297% 3.20%
Silicon ( Si ) 7440-21-3 1.282 0.294% 0.73%
Magnesium ( Mg ) 7439-95-4 0.309 0.071% 0.18%
Silver ( Ag ) 7440-22-4 2.829 0.648% 1.60%
Molding 234.2 53.68 536,774
Silica (SiO
2
)
60676-86-0 208.438 47.773% 89.00%
Compound
Epoxy Resin (1) (Trade secret) 7.026 1.610% 3.00%
Epoxy Resin (2) (Trade secret) 4.684 1.074% 2.00%
Phenol Resin (1) (Trade secret) 4.684 1.074% 2.00%
Phenol Resin (2) (Trade secret) 4.684 1.074% 2.00%
Carbon Black (C ) 1333-86-4 0.703 0.161% 0.30%
Others (Trade secret) 3.981 0.913% 1.70%
Plating of
lead frame
Solder Plating 9.55 2.19 21,888 Tin (Sn) 7440-31-5 9.550 2.189% 100.00%
Jun./08/2022
Weight
(mg)
ppm Material CAS No.
Chip
Protection
%
Model (Part) Number
AS6CE4016B-45ZIN
Material
wt% of
total Mass
Material
wt% of
Sub part
Package Weight (mg)
436.31
Pin count /Package
Weight
(mg)
Composed
parts
Purpose
44L 400mil TSOPII