5G Networks, LTE / Network Switches and Wireless Routers /
Radars and Getways / Power Supplies / Remote Radio Units
Board-to-Board
IDC Socket
Cable Assembly
High-Speed
ConnectorS
Up to 4Gbps
1.27 mm
Dual Rows
CONTENT
CONCEPT
CHARACTERISTICS
1
2
ADVANTAGES
HIGH FREQUENCY CHARACTERISTICS
3
4
CBEC225 SERIES
GBEC207 SERIESBoard-to-Board
GBEC208 SERIES
GBEC209 SERIES
GBED204 SERIES
CBEC223 SERIES
CBEC224 SERIES
CBED202 SERIES
6
7
8
9
10
11
12
13
CQEA217 SERIESCable Assemblies
GQEC201 SERIESIDC Socket
LQQE2XX SERIES
15
17
18
MATING
PACKAGING
19
20 - 22
1
GENERAL
CONCEPT
Mechanical
Electrical
Environment
Description
Description
Description
Standard
Standard
Standard
Mechanical Shock
Current Rating
Withstand Voltage
Contact Resistance
Insulation Resistance
Temperature Rise
Durability
Contact Retention Force
Mating / Unmating Force
Vibration, Sine
Shock, Half Sine
Operating Temperature / Humidity
Salt Spray
Thermal Shock
Temperature Life
Humidity Test
Resistance to Soldering Heat
EIA-364-20
EIA-364-23
EIA-364-21
EIA-364-70
EIA-364-26
EIA-364-32
EIA-364-17
EIA-364-56
EIA-364-31
EIA-364-09
EIA-364-37
EIA-364-13
EIA-364-27
EIA-364-28
Instant rupture ≤ 1 μs Max.
-55℃ to 125℃ / 85% or lower
1.7A/Pin(PCB); 0.8A/Pin(Cable)
AC 500V
25 mΩ or lower
10000 MΩ or higher
ΔT30° C Maximum
Instant rupture ≤ 1 μs Max.
Instant rupture ≤ 1 μs Max.
≥ 0.1N / Pin
500 cycles
≤ 0.5N / Pin
Test Condition: 40±2℃, 90-95% RH, 96 hrs.
Peak Temp.: 260℃/10s Maximum
No puncture, contact resistance <35mΩ
Test Condition: Atmosphere: 5% salt-solution
Test Condition: 105℃, 96 hrs.
SPECIFICATION
The system series is designed specifically with robust terminals and high-temperature plastic for
high-speed industrial applications. The unique contact structure allows it to maintain a steady
impedance profile, which ultimately minimizes both the noise and signal loss over the connectivity,
with a potential secure data transmission up to 8Gbps.
(4Gbps differential signaling, two pairs are driven.)