The ESD9D5.0C Series of Transient Voltage Suppressors (TVS)
are designed to replace multilayer varistors (MLVs) in portable
applications such as cell phones, notebook computer, and PDAs.
They offer superior electrical characteristics such as lower clamping
voltage and no device degradation when compared to MLVs. They
are designed to protect sensitive semiconductor components from
damage or upset due to electrostatic discharge (ESD), lightning,
electrical fast transients (EFT), and cable discharge events (CDE).
IEC61000-4-2 ESD 15KV Air, 8KV contact compliance
SOD923 surface mount package
Peak power dissipation of 100W under 8/20μs waveform
Working voltage: 5V
Low leakage current
Low operating and clamping voltages
Solid-state silicon avalanche technology
Lead Free/RoHS compliant
Solder reflow temperature: Pure Tin-Sn, 260~270
Flammability rating UL 94V-0
Meets MSL level 1, per J-STD-020
Rating Symbol Value Unit
Peak pulse power (tp=8/20μs waveform) P
PP
100 W
ESD voltage (Contact discharge)
V
ESD
±8
kV
ESD voltage (Air discharge) ±15
Lead soldering temperature T
L
260
Storage & operating temperature range T
STG
,T
J
-55~+150
Electrostatic Discharged Protection Devices (ESD) Data Sheet
Description
Pin Configuration
Features
Maximum Ratings
ESD9D5.0C
1 of 4
REV.08
Electrical Characteristics (T
J
=25
Parameter Symbol Condition Min. Typ. Max. Unit
Reverse stand-off voltage V
RWM
5 V
Reverse breakdown voltage V
BR
I
BR
=1mA 5.6 8 V
Reverse leakage current I
R
V
R
=5V
1 μA
Clamping voltage (tp=8/20μs) V
C
I
PP
=1A 9.8 V
Off state junction capacitance C
J
0Vdc,f=1MHz
15 pF
Typical Characteristics Curves
Figure 1. Power Derating Curve Figure 2. Pulse Waveforms
Peak Power Dissipation (%)
t-Time (μs)
t
d
=t|I
PP
/2
t
r
Peak value Ipp
Waveform
Parameters:
t
r
=8µs
t
d
=20µs
100
90
80
70
60
50
40
30
20
10
0
110
25 3015 201005
Figure 3. Clamping Voltage vs. Peak Pulse Current Figure 4. ESD Clamping(8kV Contact IEC61000-4-2)
Clamping Voltage (V)
ESD9D5.0C
2 of 4
REV.08