Rev: 2021 Aug.
High Tg / Low CTE / Lead Free
EM-827 / EM-827B
Low Z-axis CTE < 3.0% (50~260℃)
Excellent thermal stability for lead-free processing
For general application
Applicable IPC-4101 Slash Sheets: /98, /99, /101, /126
Basic Laminate Property
Property
Item
IPC-TM-650
Test Condition
Unit
Typical Value
Thermal
Tg
2.4.25
DSC
℃
175
2.4.24
TMA
℃
160
2.4.24.4
DMA
℃
185
CTE, X/Y-axis
2.4.24.5
< Tg, TMA
ppm/℃
12/15
CTE, Z-axis
2.4.24
< Tg, TMA
ppm/℃
40~45
> Tg, TMA
ppm/℃
200~220
Z-axis Expansion
2.4.24
50~260℃
%
2.6
Td
2.4.24.6
TGA (5% W.L)
℃
350
T288
2.4.24.1
Clad
Min.
>25
Etched
Min.
>30
Electrical
Dk
(R/C: 50%)
1 MHz
2.5.5.9
C-24/23/50
-
4.8
1 GHz
-
4.3
Df
(R/C: 50%)
1 MHz
2.5.5.9
C-24/23/50
-
0.018
1 GHz
-
0.019
Volume Resistivity
2.5.17.1
C-96/35/90
MΩ-cm
>10
10
Surface Resistivity
2.5.17.1
C-96/35/90
MΩ
>10
9
Physical
Water Absorption
2.6.2.1
E-1/105+D-24/23
%
0.15
Peel
Strength
(HTE)
0.5 oz
2.4.8
As Received
lb/in
6.5
After Thermal Stress
lb/in
6.5
1.0 oz
2.4.8
As Received
lb/in
8.5
After Thermal Stress
lb/in
8.5
Flexural
Strength
Warp
2.4.4
As Received
MPa
510~570
Fill
As Received
MPa
450~500
Flame Resistance
UL-94
A & E-24/125
-
V-0
Above typical values are tested under specified constructions and not intended for specification.